Invention Grant
- Patent Title: Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
- Patent Title (中): 改善基板的加工膜的表面粗糙度的方法和基板的处理装置
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Application No.: US12574503Application Date: 2009-10-06
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Publication No.: US08646403B2Publication Date: 2014-02-11
- Inventor: Yuichiro Inatomi
- Applicant: Yuichiro Inatomi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-162054 20030606
- Main IPC: B05C11/00
- IPC: B05C11/00 ; B05C13/00 ; B05C13/02 ; B05C15/00 ; B05B15/04 ; B05B13/02 ; B05B1/26 ; B05B1/28
Abstract:
A treatment apparatus for treating a substrate on a surface of which a treatment film has been formed and subjected to exposure processing and developing treatment. The treatment apparatus includes a nozzle for supplying a solvent gas of the treatment film to the surface of the treatment film on the substrate, and a moving mechanism for moving the nozzle which is supplying the solvent gas, relative to the substrate. The nozzle has an elongated discharge portion at least longer than a diameter of the substrate and partition plates at a front and a rear in the moving direction of the nozzle.
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