Invention Grant
- Patent Title: Method and apparatus for accurate die-to-wafer bonding
- Patent Title (中): 用于准确的晶片到晶片键合的方法和装置
-
Application No.: US14088780Application Date: 2013-11-25
-
Publication No.: US08722436B2Publication Date: 2014-05-13
- Inventor: Chyi Shyuan Chern , Hsin-Hsien Wu , Chih-Kuang Yu , Hung-Yi Kuo
- Applicant: TSMC Solid State Lighting Ltd.
- Applicant Address: TW HsinChu
- Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee Address: TW HsinChu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.
Public/Granted literature
- US20140065741A1 Method and Apparatus for Accurate Die-to-Wafer Bonding Public/Granted day:2014-03-06
Information query
IPC分类:
