-
公开(公告)号：US09324910B2
公开(公告)日：2016-04-26
申请号：US14558798
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Hsien Wu , Chyi Shyuan Chern , Chun-Lin Chang , Ching-Wen Hsiao , Kuang-Huan Hsu
CPC classification number: H01L33/22 , H01L21/2654 , H01L21/26546 , H01L21/26593 , H01L33/0025 , H01L33/06 , H01L33/32
Abstract: A device includes: a substrate; and a doped III-V compound layer disposed over the substrate; wherein: the doped III-V compound layer includes an upper boundary; the upper boundary has a micro-roughened texture and a macro-roughened texture where the micro-roughened texture located on; and the upper boundary includes dopant ions that are not present in a remainder of the doped III-V compound layer underneath the upper boundary.
Abstract translation: 一种器件包括：衬底; 以及设置在所述衬底上的掺杂III-V化合物层; 其中：掺杂的III-V化合物层包括上边界; 上边界具有微粗糙纹理和位于其上的微粗糙纹理的宏观粗糙纹理; 并且上边界包括在上边界下方的掺杂III-V化合物层的剩余部分中不存在的掺杂离子。
-
公开(公告)号：US20150083998A1
公开(公告)日：2015-03-26
申请号：US14558798
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Hsien Wu , Chyi Shyuan Chern , Chun-Lin Chang , Ching-Wen Hsiao , Kuang-Huan Hsu
CPC classification number: H01L33/22 , H01L21/2654 , H01L21/26546 , H01L21/26593 , H01L33/0025 , H01L33/06 , H01L33/32
Abstract: A light-emitting diode (LED) element includes a substrate and a GaN layer formed on the substrate. The GaN layer includes a boundary layer including a surface of the GaN opposing the substrate. The surface has a micro-roughening texture and a macro-roughening texture. The boundary layer includes at least one of As, Si, P, Ge, C, B, F, N, Sb, and Xe ions.
Abstract translation: 发光二极管（LED）元件包括衬底和形成在衬底上的GaN层。 GaN层包括边界层，其包括与衬底相对的GaN的表面。 表面具有微粗糙纹理和宏观粗糙纹理。 边界层包括As，Si，P，Ge，C，B，F，N，Sb和Xe离子中的至少一种。
-
3.发明申请公开(公告)号：US20140093990A1
公开(公告)日：2014-04-03
申请号：US14102600
申请日：2013-12-11
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Yung-Chang Chen , Hsin-Hsien Wu , Ming Shing Lee , Huai-En Lai , Fu-Wen Liu , Andy Wu
IPC: H01L33/58
CPC classification number: H01L33/58 , H01L24/24 , H01L24/82 , H01L33/486 , H01L33/62 , H01L2224/32225 , H01L2924/01029 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2933/0066 , H01L2924/00
Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
Abstract translation: 光发射器包括在封装晶片上的发光二极管（LED），透明绝缘体以及LED管芯与封装晶片上的一个或多个接触焊盘之间的一个或多个透明电连接器。 透明绝缘体沉积在封装晶圆上，并使用光刻法或丝网印刷法连接LED芯片。 使用物理气相沉积，化学气相沉积，旋涂，喷涂或丝网印刷沉积透明电连接器，并且可以使用光刻工艺和蚀刻来图案化。
-
公开(公告)号：US09000455B2
公开(公告)日：2015-04-07
申请号：US13792136
申请日：2013-03-10
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Ming-Shing Lee , Chyi-Shyuan Chern , Hsin-Hsien Wu , Yung-Chang Chen , Ming-Hua Lo , Chu-Ching Tsai
CPC classification number: H01L33/08 , C23C4/01 , H01L21/00 , H01L21/68721 , H01L2933/0041
Abstract: A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly.
Abstract translation: 荫罩组件包括固定组件，其被配置为保持构造成保持多个模具的衬底。 固定组件包括多个引导销和一个包括用于引导销的孔的荫罩，所述孔允许导销在一个方向上自由运动。 固定组件包括多个嵌入式磁体，其构造成将荫罩固定到固定组件。
-
公开(公告)号：US20140235053A1
公开(公告)日：2014-08-21
申请号：US14267303
申请日：2014-05-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chun-Lin Chang , Hsing-Kuo Hsia , Hung-Yi Kuo
IPC: H01L21/768
CPC classification number: H01L21/76801 , H01L21/02057 , H01L21/3065 , H01L21/76898
Abstract: A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.
Abstract translation: 形成贯通硅通孔（TSV）开口的方法包括通过基板形成TSV开口。 使用第一种化学物质去除在TSV开口的侧壁上的衬底的材料的重铸。 TSV开口的侧壁通过基本上除去第一种化学物质的残留物而用第二种化学品清洗。
-
Patent Agency Ranking
公开(公告)号：US08722436B2
公开(公告)日：2014-05-13
申请号：US14088780
申请日：2013-11-25
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chih-Kuang Yu , Hung-Yi Kuo
IPC: H01L21/00
CPC classification number: H01L33/62 , H01L23/49513 , H01L25/0753 , H01L33/0095 , H01L33/08 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.
Abstract translation: 一种发光二极管（LED）封装的方法包括将多个LED管芯耦合到子安装座上的对应焊盘。 具有容纳LED管芯的凹入凹槽的模具装置放置在子安装座上。 子载体，LED管芯和模具装置在热回流过程中被加热以将LED管芯接合到接合焊盘。 每个凹槽在加热期间基本上限制相对于接合焊盘的LED管芯的移位。
-
公开(公告)号：US09224636B2
公开(公告)日：2015-12-29
申请号：US14267303
申请日：2014-05-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chun-Lin Chang , Hsing-Kuo Hsia , Hung-Yi Kuo
IPC: H01L21/768 , H01L21/02 , H01L21/3065
CPC classification number: H01L21/76801 , H01L21/02057 , H01L21/3065 , H01L21/76898
Abstract: A method includes forming an opening in a substrate, and the opening completely extends through the substrate. A recast material is formed on sidewalls of the substrate exposed by the opening. A first chemical is applied in the opening to remove the recast material, wherein a residue of the first chemical remains on portions of the sidewalls after the applying of the first chemical. Moreover, A second chemical is applied in the opening to remove the residue of the first chemical, and the second chemical is different from the first chemical.
Abstract translation: 一种方法包括在基板中形成开口，并且开口完全延伸穿过基板。 在由开口暴露的衬底的侧壁上形成重铸材料。 在开口中施加第一种化学品以去除重铸材料，其中在施加第一种化学品之后，第一种化学物质的残留物残留在侧壁的部分上。 此外，在开口中施加第二种化学物质以除去第一化学品的残余物，而第二种化学品与第一种化学品不同。
-
公开(公告)号：US20140252380A1
公开(公告)日：2014-09-11
申请号：US13792136
申请日：2013-03-10
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Ming-Shing Lee , Chyi-Shyuan Chern , Hsin-Hsien Wu , Yung-Chang Chen , Ming-Hua Lo , Chu-Ching Tsai
IPC: H01L33/08
CPC classification number: H01L33/08 , C23C4/01 , H01L21/00 , H01L21/68721 , H01L2933/0041
Abstract: A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly.
Abstract translation: 荫罩组件包括固定组件，其被配置为保持构造成保持多个模具的衬底。 固定组件包括多个引导销和一个包括用于引导销的孔的荫罩，所述孔允许导销在一个方向上自由运动。 固定组件包括多个嵌入式磁体，其构造成将荫罩固定到固定组件。
-
公开(公告)号：US09287478B2
公开(公告)日：2016-03-15
申请号：US14272626
申请日：2014-05-08
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chih-Kuang Yu , Hung-Yi Kuo
IPC: H01L21/603 , H01L33/62 , H01L23/495 , H01L33/00 , H01L33/08 , H01L25/075
CPC classification number: H01L33/62 , H01L23/49513 , H01L25/0753 , H01L33/0095 , H01L33/08 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A plurality of conductive pads are disposed on a substrate. A plurality of semiconductor dies are each disposed on a respective one of the conductive pads. A mold device is positioned over the substrate. The mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath.
Abstract translation: 多个导电焊盘设置在基板上。 多个半导体管芯各自设置在相应的一个导电焊盘上。 模具装置位于衬底上。 模具装置包括多个凹槽，每个凹槽被配置为容纳下面的半导体模具中的相应的一个。
-
10.发明授权公开(公告)号：US08889440B2
公开(公告)日：2014-11-18
申请号：US14102600
申请日：2013-12-11
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Yung-Chang Chen , Hsin-Hsien Wu , Ming Shing Lee , Huai-En Lai , Fu-Wen Liu , Andy Wu
CPC classification number: H01L33/58 , H01L24/24 , H01L24/82 , H01L33/486 , H01L33/62 , H01L2224/32225 , H01L2924/01029 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2933/0066 , H01L2924/00
Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
Abstract translation: 光发射器包括在封装晶片上的发光二极管（LED），透明绝缘体以及LED管芯与封装晶片上的一个或多个接触焊盘之间的一个或多个透明电连接器。 透明绝缘体沉积在封装晶圆上，并使用光刻法或丝网印刷法连接LED芯片。 使用物理气相沉积，化学气相沉积，旋涂，喷涂或丝网印刷沉积透明电连接器，并且可以使用光刻工艺和蚀刻来图案化。
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.014 seconds)
