Invention Grant
- Patent Title: Stable tin free catalysts for electroless metallization
- Patent Title (中): 稳定的无锡金属化无锡催化剂
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Application No.: US13589019Application Date: 2012-08-17
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Publication No.: US09138733B2Publication Date: 2015-09-22
- Inventor: Feng Liu , Maria Anna Rzeznik
- Applicant: Feng Liu , Maria Anna Rzeznik
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Main IPC: B05D3/04
- IPC: B05D3/04 ; B05D3/10 ; B01J21/00 ; B01J23/00 ; B01J25/00 ; B01J29/00 ; B01J31/00 ; B01J31/06 ; B01J23/44 ; B01J31/28 ; B01J35/00 ; C23C18/30 ; C23C18/20 ; B01J37/16 ; B01J37/02 ; C23C18/32 ; C23C18/38
Abstract:
Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
Public/Granted literature
- US20130216713A1 STABLE TIN FREE CATALYSTS FOR ELECTROLESS METALLIZATION Public/Granted day:2013-08-22
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