Invention Grant
- Patent Title: Coating slit apparatus for coating a substrate and method for coating using the same
- Patent Title (中): 用于涂布基材的涂布缝隙装置及其使用方法
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Application No.: US13624211Application Date: 2012-09-21
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Publication No.: US09177841B2Publication Date: 2015-11-03
- Inventor: Gil-Hwan Yeo , Dong-Hwan Kim , Sung-Ku Baek , Chan-Uk Jon , Il-Sup Choi
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2012-0034189 20120403
- Main IPC: B05B7/06
- IPC: B05B7/06 ; B05C11/10 ; B05C5/02 ; B05D1/26 ; H01L21/67 ; B05B7/02 ; G03F7/16 ; G09G3/34 ; B05C11/00 ; B05B7/08 ; B05C9/02 ; G02B26/00
Abstract:
An exemplary embodiment of the present invention discloses a coating apparatus including a stage configured to receive a substrate and a coating slit part. The coating slit part includes a guide member, a first body, a second body, and a discharge nozzle. The coating slit part is configured to dispose a coating material on the substrate.
Public/Granted literature
- US20130260045A1 APPARATUS FOR COATING AND METHOD FOR COATING USING THE SAME Public/Granted day:2013-10-03
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