- Patent Title: Substrate processing with reduced warpage and/or controlled strain
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Application No.: US13913045Application Date: 2013-06-07
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Publication No.: US09401277B2Publication Date: 2016-07-26
- Inventor: Yun Wang , Shaoyin Chen
- Applicant: Ultratech, Inc.
- Applicant Address: US CA San Jose
- Assignee: Ultratech, Inc.
- Current Assignee: Ultratech, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Peters Verny, LLP
- Agent Allston L. Jones
- Main IPC: B23K26/00
- IPC: B23K26/00 ; H01L21/263 ; B23K26/08 ; C30B1/06 ; H01L21/02
Abstract:
Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.
Public/Granted literature
- US20130273751A1 SUBSTRATE PROCESSING WITH REDUCED WARPAGE AND/OR CONTROLLED STRAIN Public/Granted day:2013-10-17
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