Invention Grant
- Patent Title: Coating apparatus and method of forming coating film
- Patent Title (中): 涂膜装置及其形成方法
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Application No.: US14291575Application Date: 2014-05-30
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Publication No.: US09573144B2Publication Date: 2017-02-21
- Inventor: Lan-Hai Wang , Yong-Hung Yang , Ding-I Liu , Si-Wen Liao , Po-Hsiung Leu , Mao-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; B05B1/30 ; B05B1/18 ; B05C11/08 ; C23C18/00 ; H01L21/67 ; H01L31/18
Abstract:
A method of forming a coating film over a substrate is provided. The method includes spinning the substrate. The method further includes providing a central coating liquid spray over a central portion of the substrate. The method also includes providing first coating liquid sprays over the substrate. The first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by a same first distance.
Public/Granted literature
- US20150348779A1 COATING APPARATUS AND METHOD OF FORMING COATING FILM Public/Granted day:2015-12-03
Information query
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