Invention Grant
- Patent Title: Underfill composition for encapsulating a bond line
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Application No.: US14196581Application Date: 2014-03-04
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Publication No.: US09670377B2Publication Date: 2017-06-06
- Inventor: Pawel Czubarow , Toshiyuki Sato , Tsutomu Masuko
- Applicant: NAMICS CORPORATION
- Applicant Address: JP Niigata
- Assignee: NAMICS CORPORATION
- Current Assignee: NAMICS CORPORATION
- Current Assignee Address: JP Niigata
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: C08K3/04
- IPC: C08K3/04 ; C08K3/28 ; C08L63/00 ; C09D163/00 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; C08K3/22 ; C08K3/38 ; H01L25/065 ; C08K3/34 ; C08G59/50
Abstract:
An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.
Public/Granted literature
- US20150252217A1 UNDERFILL COMPOSITION FOR ENCAPSULATING A BOND LINE Public/Granted day:2015-09-10
Information query
