公开(公告)号：US20230013549A1

公开(公告)日：2023-01-19

申请号：US17782211

申请日：2020-09-25

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Daisuke Hashimoto ,  Yoshitaka Kamata ,  Toshiyuki Sato

IPC: H01C7/10 ,  H01C7/102 ,  H01C17/065

Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

公开(公告)号：US09670377B2

公开(公告)日：2017-06-06

申请号：US14196581

申请日：2014-03-04

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Toshiyuki Sato ,  Tsutomu Masuko

IPC: C08K3/04 ,  C08K3/28 ,  C08L63/00 ,  C09D163/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  C08K3/22 ,  C08K3/38 ,  H01L25/065 ,  C08K3/34 ,  C08G59/50

CPC classification number: C09D163/00 ,  C08G59/5033 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K2003/282 ,  C08K2201/003 ,  C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/05342 ,  H01L2924/01012 ,  H01L2924/0665 ,  H01L2924/0493 ,  H01L2924/01005 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

公开(公告)号：US11935673B2

公开(公告)日：2024-03-19

申请号：US17782211

申请日：2020-09-25

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Daisuke Hashimoto ,  Yoshitaka Kamata ,  Toshiyuki Sato

IPC: H01C7/10 ,  H01C7/102 ,  H01C17/065

CPC classification number: H01C7/1006 ,  H01C7/102 ,  H01C17/0652 ,  H01C17/06586

Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

公开(公告)号：US09417228B2

公开(公告)日：2016-08-16

申请号：US14256201

申请日：2014-04-18

Applicant: Namics Corporation

Inventor： Toshiaki Enomoto ,  Arata Hayashigaki ,  Masaaki Hoshiyama ,  Toyokazu Hotchi ,  Toshiyuki Sato

IPC: G01N33/44 ,  G01N11/00 ,  C09J9/00

CPC classification number: G01N33/442 ,  G01N11/00 ,  G01N2011/0093 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00

Abstract: A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

Abstract translation: 提供预测热固性树脂的粘度行为的方法，其能够预测热固性树脂的粘度行为，并且在获得良好的焊接连接的同时抑制底部填充物中的空隙产生。 该方法包括：测量反应速率和测量粘度行为，以分别测量三种或更多种温度升高的热固性树脂的量热峰和粘度行为; 通过测量反应速率达到Kamal模型公式获得的每个温度升高速率来拟合测量数据以获得拟合曲线; 拟合粘度行为，以拟合Kamal模型公式中的参数和通过测量粘度行为获得的每个温度升高速率的测量数据，得到卡斯特罗 - 马科斯科模型公式，以获得拟合曲线; 并计算虚拟粘度行为以通过基于通过拟合粘度行为获得的每个升温速率的每个拟合曲线的模拟来计算任意温度升高的热固性树脂的虚拟粘度行为。

公开(公告)号：US20140316102A1

公开(公告)日：2014-10-23

申请号：US14256201

申请日：2014-04-18

Applicant: Namics Corporation

Inventor： Toshiaki Enomoto ,  Arata Hayashigaki ,  Masaaki Hoshiyama ,  Toyokazu Hotchi ,  Toshiyuki Sato

IPC: G01N33/44 ,  C09J9/00

CPC classification number: G01N33/442 ,  G01N11/00 ,  G01N2011/0093 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00

Abstract: A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

Abstract translation: 提供预测热固性树脂的粘度行为的方法，其能够预测热固性树脂的粘度行为，并且在获得良好的焊接连接的同时抑制底部填充物中的空隙产生。 该方法包括：测量反应速率和测量粘度行为，以分别测量三种或更多种温度升高的热固性树脂的量热峰和粘度行为; 通过测量反应速率达到Kamal模型公式获得的每个温度升高速率来拟合测量数据以获得拟合曲线; 拟合粘度行为，以拟合Kamal模型公式中的参数和通过测量粘度行为获得的每个温度升高速率的测量数据，得到卡斯特罗 - 马科斯科模型公式，以获得拟合曲线; 并计算虚拟粘度行为以通过基于通过拟合粘度行为获得的每个升温速率的每个拟合曲线的模拟来计算任意温度升高的热固性树脂的虚拟粘度行为。

公开(公告)号：US10141090B2

公开(公告)日：2018-11-27

申请号：US15860136

申请日：2018-01-02

Applicant: NAMICS CORPORATION

Inventor： Yoshitaka Kamata ,  Pawel Czubarow ,  Toshiyuki Sato ,  Takayuki Fujita

IPC: H01C7/105 ,  C08L63/00

Abstract: A resin composition which includes (A) an epoxy resin, (B) a curing agent, and (C) carbon nanotubes, wherein the carbon nanotubes contain therein semiconducting single-walled carbon nanotubes in an amount of 70% by weight or more. A cured product of a paste made from the resin composition can be used to form a varistor element.