Invention Grant
- Patent Title: Method for fabricating blackened conductive patterns
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Application No.: US14481273Application Date: 2014-09-09
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Publication No.: US09839138B2Publication Date: 2017-12-05
- Inventor: Kwang Choon Chung , Ji Hoon Yoo , Su-Han Kim , Byung Hun Kim
- Applicant: Inktec Co., Ltd.
- Applicant Address: KR Ansan-si, Kyeongki-do
- Assignee: Inktec Co., Ltd.
- Current Assignee: Inktec Co., Ltd.
- Current Assignee Address: KR Ansan-si, Kyeongki-do
- Agency: The Webb Law Firm
- Priority: KR10-2007-0128149 20071211
- Main IPC: H05K3/12
- IPC: H05K3/12 ; H05K1/09 ; H05K3/10

Abstract:
The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
Public/Granted literature
- US20140377455A1 Method for Fabricating Blackened Conductive Patterns Public/Granted day:2014-12-25
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