公开(公告)号：US20070284758A1

公开(公告)日：2007-12-13

申请号：US11438657

申请日：2006-05-22

Applicant: Jian Zhang ,  Davide Simone ,  Christopher Carter ,  Laura Meyer ,  Charles Becker ,  Florian Schattenmann ,  Sandeep Tonapi ,  Slawomir Rubinsztajn ,  Christopher Keimel

Inventor： Jian Zhang ,  Davide Simone ,  Christopher Carter ,  Laura Meyer ,  Charles Becker ,  Florian Schattenmann ,  Sandeep Tonapi ,  Slawomir Rubinsztajn ,  Christopher Keimel

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.

Abstract translation: 提供电子封装。 电子封装可以包括具有限定开口的表面的底部填充层。 电子封装可以包括设置在开口内的聚合物凸块结构。 提供了用作底部填充层的层压体。 提供相关方法。

公开(公告)号：US20060094809A1

公开(公告)日：2006-05-04

申请号：US11078566

申请日：2005-03-11

Applicant: Davide Simone ,  Larry Lewis ,  Shahid Murtuza

Inventor： Davide Simone ,  Larry Lewis ,  Shahid Murtuza

IPC: C08K3/22 ,  B01F17/00

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K3/22 ,  C08L83/00 ,  C09J183/04

Abstract: The instant invention provides for an electrically and thermally conductive silicone adhesive composition comprising an alkenyl siloxane, a hydrido-siloxane, an electrically and thermally conductive filler, an optional thermally conductive filler, an adhesion promoter that does not deactivate the hydrosilylation catalyst, and a hydrosilylation catalyst and a hydrosilylation catalyst inhibitor.

Abstract translation: 本发明提供一种导电和导热的硅氧烷粘合剂组合物，其包含烯基硅氧烷，氢化硅氧烷，导电和导热填料，任选的导热填料，不使氢化硅烷化催化剂失活的粘合促进剂和氢化硅烷化 催化剂和氢化硅烷化催化剂抑制剂。

公开(公告)号：US20050045855A1

公开(公告)日：2005-03-03

申请号：US10654391

申请日：2003-09-03

Applicant: Sandeep Tonapi ,  Hong Zhong ,  Davide Simone ,  Raymond Fillion

Inventor： Sandeep Tonapi ,  Hong Zhong ,  Davide Simone ,  Raymond Fillion

IPC: C09K5/14 ,  H01L23/373 ,  H01B1/00

CPC classification number: H01L24/29 ,  C09K5/14 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3737 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

Abstract translation: 热界面组合物含有非导电的微米尺寸的填料和与聚合物基质混合的导电纳米颗粒。 这样的组合物增加了聚合物复合材料的体积热导率，并且降低了热界面材料和相应配合表面之间存在的热界面电阻。 这样的组合物是非导电的。 含有纳米颗粒的制剂与没有纳米颗粒的制剂相比，显示出微米级颗粒的相分离较少。

公开(公告)号：US20060045838A1

公开(公告)日：2006-03-02

申请号：US10925312

申请日：2004-08-24

Applicant: Patrick Lucien Malenfant ,  Walter Cicha ,  Pierre-Andre Bui ,  Davide Simone

Inventor： Patrick Lucien Malenfant ,  Walter Cicha ,  Pierre-Andre Bui ,  Davide Simone

IPC: B32B9/00 ,  D01F9/12

CPC classification number: B82Y30/00 ,  B82Y40/00 ,  C01B32/174 ,  C01B2202/22 ,  D01F11/14 ,  Y10T428/30

Abstract: A nanostructure having at least one nanotube and at least one chemical moiety non-covalently attached to the at least one nanotube. At least one dendrimer is bonded to the chemical moiety. The chemical moiety may include soluble polymers, soluble oligomers, and combinations thereof. A method of dispersing at least one nanotube is also described. The method includes providing at least one nanotube and at least one chemical moiety to a solvent; debundling the nanotube; and non- covalently attaching a chemical moiety to the nanotube, wherein the non-covalently attached chemical moiety disperses the nanotube. A method of separating at least one semi-conducting carbon nanotube is also described.

Abstract translation: 具有至少一个纳米管和至少一个非共价连接到所述至少一个纳米管的化学部分的纳米结构。 至少一个树枝状大分子结合到化学部分。 化学部分可包括可溶性聚合物，可溶性低聚物及其组合。 还描述了分散至少一种纳米管的方法。 该方法包括向溶剂提供至少一个纳米管和至少一个化学部分; 分解纳米管; 并且非共价连接化学部分到纳米管，其中非共价连接的化学部分分散纳米管。 还描述了分离至少一种半导电碳纳米管的方法。

公开(公告)号：US20070131912A1

公开(公告)日：2007-06-14

申请号：US11177901

申请日：2005-07-08

Applicant: Davide Simone ,  Thomas Angeliu ,  Sandeep Tonapi ,  David Gibson ,  Jian Zhang

Inventor： Davide Simone ,  Thomas Angeliu ,  Sandeep Tonapi ,  David Gibson ,  Jian Zhang

IPC: H01B1/12

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C08K3/08 ,  C08K2201/011 ,  C08L83/00 ,  C08L2666/54 ,  C09J9/02 ,  C09J11/04 ,  C09J183/04 ,  C09J2483/00 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

Abstract translation: 本发明提供一种导电粘合剂组合物，其具有固化的低模量弹性体和冶金结合的微米级金属颗粒和纳米尺寸的金属颗粒。 低弹性弹性体通过减轻产生的应力来提供机械坚固性和可靠性; 并且冶金结合的微米级金属颗粒和纳米级金属颗粒提供具有最小界面电阻的连续导电路径。 纳米尺寸金属颗粒的添加降低了熔化温度，并允许在可控温度下进行冶金结合。