Abstract:
본 발명은 탄소나노튜브의 밀도제어방법, 이를 이용한 밀도가 제어된 탄소나노튜브 전계방출원 및 이의 제조방법에 관한 것이다. 보다 상세하게, 본 발명은 기판 상에 형성된 탄소나노튜브를 탄소나노튜브 팁처리 용액으로 처리하는 단계를 포함하는 탄소나노튜브의 밀도제어방법, 및 이를 이용한 탄소나노튜브 전계방출원의 제조방법을 제공한다. 또한 본 발명은 기판; 기판 상에 형성되고, 탄소나노튜브 팁처리 용액으로 처리된 탄소나노튜브층; 및 탄소나노튜브 층의 상부에 형성된 금속층을 포함하는 탄소나노튜브 전계방출원을 제공한다. 본 발명에 따르면, 적은 비용과 간단한 용액처리공정만으로도 탄소나노튜브의 팁부분이 모인 집합체들로 이루어진 구조를 통하여 탄소나노튜브층 말단의 밀도를 낮게 제어한다. 또한, 동시에 구조적으로도 안정하여 전자방출능이 우수하다. 탄소나노튜브, 전계방출원, 밀도, 용액처리, 금속층
Abstract:
PURPOSE: Carbon nano-tube and a method for manufacturing the same are provided to increase the state density of electrons around Fermi level and lower a work function by combining ruthenium nano-particles with the wall of the carbon nano-tube. CONSTITUTION: A method for manufacturing carbon nano-tube includes the following: Ruthenium dioxide powder is deposited on carbon nano-tube. The deposited ruthenium dioxide powder is reduced to form ruthenium nano-particles. The carbon nano-tube is directly grown on a substrate on which a buffer layer and a seed layer are formed. The buffer layer is formed based on one selected from a group including SiO_2, Al_2O_3, and MgO. The seed layer is formed based on one metal selected from a group including nickel, iron, and cobalt.
Abstract:
A density controlled carbon nanotube field emission source, a preparation method thereof, and a density control method of carbon nanotube are provided to improve the structural stability by lowering the density of the carbon nano tube layer. A buffer layer(110) is formed on the top of the substrate(100). A catalyst layer(120) is formed on the top of the buffer layer. The buffer layer is formed of the chrome(Cr), the tantalum(Ta), and the titanium(Ti) or their alloy. The catalyst layer is formed of the nickel(Ni), the iron(Fe), and the cobalt(Co) or their alloy. The carbon nanotube is perpendicularly grown up on the catalyst layer using the direct current plasma assisted chemical vapor deposition under the hydrocarbon gas environment including the methane gas, the acetylene gas or the ethylene gas. The substrate including carbon nanotube is dipped in the carbon nanotube tip process solution in 5 to 10 minutes. The carbon nanotube tip process solution is removed from the carbon nanotube or the substrate.