公开(公告)号：KR101988890B1

公开(公告)日：2019-10-01

申请号：KR1020120121515

申请日：2012-10-30

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  배호은 ,  배현철 ,  엄용성 ,  전수정

IPC: H01L21/60

公开(公告)号：KR101857157B1

公开(公告)日：2018-05-15

申请号：KR1020110144690

申请日：2011-12-28

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  엄용성 ,  배현철 ,  문종태 ,  배호은

IPC: H01L23/48

CPC classification number: H01L2224/11

Abstract: 본발명은기판상에스크린마스크없이미세한크기의솔더범프를형성하는방법에관한것이다. 본발명의일 실시예에의한솔더범프형성방법은, 금속부와상기금속부를정의하는미세패턴층이형성된기판상에가이드층을형성하는단계, 상기가이드층사이로솔더분말과수지(resin)가혼합된솔더형성물질을 1차도포하는단계, 상기가이드층을제거하는단계, 상기솔더형성물질을가열하여상기솔더분말을상기금속부상에응집시키는단계, 상기 1차도포된수지와상기금속부상에응집되지않은솔더분말을제거하는단계, 상기솔더분말이응집된기판상에상기수지를 2차도포한후 가열하는단계및 상기 2차도포된수지를제거하는단계를포함한다.

公开(公告)号：KR1020140056668A

公开(公告)日：2014-05-12

申请号：KR1020120121515

申请日：2012-10-30

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  배호은 ,  배현철 ,  엄용성 ,  전수정

IPC: H01L21/60

CPC classification number: B23K1/20 ,  B23K3/0623 ,  H01L24/11 ,  H01L2224/11005 ,  H01L2224/1134 ,  H01L2224/1152 ,  H01L2924/00014

Abstract: Disclosed is a manufacturing method for a solder-on-pad. The manufacturing method comprises a step of producing a substrate having a pad; a step of forming a solder bump maker including a resin and solder power, on the substrate; a step of collecting the solder power on the pad by heating the solder bump maker at a temperature lower than the melting point of the solder power; and a step of removing the resin.

Abstract translation: 公开了一种焊接焊盘的制造方法。 该制造方法包括制造具有垫的基板的步骤; 在基板上形成包括树脂和焊料功率的焊料凸块制造器的步骤; 通过在低于焊料功率的熔点的温度下加热焊料块制造器来收集焊盘上的焊料功率的步骤; 和除去树脂的步骤。

公开(公告)号：KR1020130076197A

公开(公告)日：2013-07-08

申请号：KR1020110144690

申请日：2011-12-28

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  엄용성 ,  배현철 ,  문종태 ,  배호은

IPC: H01L23/48

CPC classification number: H01L2224/11

Abstract: PURPOSE: A method for forming a solder bump is provided to form a bump having a low height by agglomerating solder powder in a metal part formed on a substrate. CONSTITUTION: A micro pattern layer (305) is formed on a substrate. A guide layer (307) is formed on the substrate. A solder formation material is firstly coated between the guide layers. Solder powder and resin are mixed with the solder formation material. The solder powder is agglomerated on a metal part (303).

Abstract translation: 目的：提供一种用于形成焊料凸块的方法，通过在形成在基板上的金属部件中凝集焊料粉末来形成具有低高度的凸块。 构成：在衬底上形成微图案层（305）。 在基板上形成引导层（307）。 焊料形成材料首先涂覆在引导层之间。 焊料粉末和树脂与焊料形成材料混合。 焊料粉末聚集在金属部件（303）上。