公开(公告)号：US12245411B2

公开(公告)日：2025-03-04

申请号：US18265597

申请日：2021-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Yuan Zhao ,  Zhiyong Xu ,  Ju Le Sun

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/24

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.

公开(公告)号：US20220089915A1

公开(公告)日：2022-03-24

申请号：US17310145

申请日：2020-02-14

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Wei Cui ,  Guannan Yin

IPC: C09J7/38 ,  C08F220/32 ,  C08F220/06 ,  C08F220/14 ,  C08F220/18 ,  C08F222/10 ,  C08F2/48

Abstract: The present invention provides a UV debondable pressure sensitive adhesive composition and an adhesive tape comprising the same. The UV debondable pressure sensitive adhesive composition comprises a polyacrylate pressure sensitive adhesive, a UV-light polymerizable polyurethane oligomer, a cationic photoinitiator and a free radical photoinitiator, wherein polymerization monomers of the polyacrylate pressure sensitive adhesive comprise an acrylic monomer having an epoxy functional group. The UV debondable pressure sensitive adhesive composition has a bonding force dropping significantly upon UV irradiation, and leaves no residual adhesive.

公开(公告)号：US20210198543A1

公开(公告)日：2021-07-01

申请号：US16754827

申请日：2018-06-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Christopher B. Walker, JR. ,  Daniel J. O'Neal

IPC: C09J183/04 ,  H04R7/06 ,  C08K5/14 ,  C09J9/00

Abstract: Thin films are provided comprising a damping adhesive comprising a polysiloxane or mixture of polysiloxanes and exhibiting a tan delta of at least 0.42 for every temperature between 20° C. and 250° C. and a tan delta at 250° C. that is no more than 0.20 greater than the minimum tan delta measured in the range of 20° C. to 250° C.; in some cases exhibiting a tan delta of at least 0.42 for every temperature between 20° C. and 200° C. and a tan delta at 200° C. that is no more than 0.08 greater than the minimum tan delta measured in the range of 20° C. to 200° C.; in some cases obtained by crosslinking polysiloxane(s) by e-beam or peroxide. Microspeaker diaphragm materials, subassemblies and transfer tapes comprising such films are also provided.

公开(公告)号：US20240040760A1

公开(公告)日：2024-02-01

申请号：US18265597

申请日：2021-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Yuan Zhao ,  Zhiyong Xu ,  Ju Le Sun

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/24

CPC classification number: H05K9/0084 ,  H05K1/0216 ,  H05K3/241 ,  H05K2201/0707

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.

公开(公告)号：US20220372348A1

公开(公告)日：2022-11-24

申请号：US17754608

申请日：2020-10-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Hongbo Liu ,  Panpan Lin ,  Qiong Juan Duan

IPC: C09J133/08 ,  H04R7/26

Abstract: The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.

公开(公告)号：US20230131805A1

公开(公告)日：2023-04-27

申请号：US17912014

申请日：2021-03-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Christopher B. Walker, JR.

IPC: H04R31/00 ,  H04R7/02 ,  C08J3/24 ,  C08J3/28

Abstract: The invention provides a diaphragm for a microspeaker and a manufacturing method thereof. The diaphragm is a single-layer diaphragm or a multi-layer diaphragm and comprises at least one layer of a chemically cross-linked thermoplastic polyester elastomer, wherein: the chemically cross-linked thermoplastic polyester elastomer has a loss factor less than or equal to 0.4 at a temperature range not higher than a softening temperature of thermoplastic polyester elastomer before chemical crosslinking plus 40° C., as measured by a rheological curve; and the diaphragm further has a yield strain in the range of 7% to 30%. The diaphragm for a microspeaker according to the technical solution of the present invention is easy to be prepared by thermoforming, and has appropriate modulus, good strength, elasticity, and thermal stability.