公开(公告)号：US20240040760A1

公开(公告)日：2024-02-01

申请号：US18265597

申请日：2021-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Yuan Zhao ,  Zhiyong Xu ,  Ju Le Sun

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/24

CPC classification number: H05K9/0084 ,  H05K1/0216 ,  H05K3/241 ,  H05K2201/0707

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.

公开(公告)号：US12245411B2

公开(公告)日：2025-03-04

申请号：US18265597

申请日：2021-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Yuan Zhao ,  Zhiyong Xu ,  Ju Le Sun

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/24

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.

公开(公告)号：US20190293849A1

公开(公告)日：2019-09-26

申请号：US16341709

申请日：2016-10-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Guanglei Du ,  John A. Wheatley ,  Yihang Lv ,  Zhiyong Xu ,  Jingfei Chen

IPC: G02B5/22

Abstract: An example article may include an optical filter and a multilayer stack adjacent the optical filter. The multilayer stack may include a plurality of layers. Each respective layer of the plurality layers may define a respective window edge of a plurality of window edges. The plurality of window edges may define an optical window configured to transmit light through the optical filter. At least a first respective window edge of the plurality of window edges may be stepped relative to at least a second respective window edge of the plurality of window edges.

公开(公告)号：US20180366867A1

公开(公告)日：2018-12-20

申请号：US15571370

申请日：2016-05-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Karl E. Wolf ,  Zhiyong Xu ,  Donald K. Larson ,  Joseph C. Carls ,  Daniel J. Treadwell

IPC: H01R13/52 ,  H02G15/196

Abstract: The present invention is directed to a weather-proofing solution for protecting a cable that includes a new weather proofing sheet, a new applicator tool and a new method of installing the weather proofing material over a cable connection to provide environmental protection to the cable connection. The weather-proofing material is a preformed sheet having a body portion and two spaced apart tail portions extending longitudinally from one end of the body portion wherein the preformed sheet has a variable elongation along its length when wrapped around the cable connection under a constant force.

公开(公告)号：US11525949B2

公开(公告)日：2022-12-13

申请号：US16341709

申请日：2016-10-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Guanglei Du ,  John A. Wheatley ,  Yihang Lv ,  Zhiyong Xu ,  Jingfei Chen

IPC: G02B5/22 ,  G01N21/15 ,  G02B5/00 ,  G01N21/17

Abstract: An example article may include an optical filter and a multilayer stack adjacent the optical filter. The multilayer stack may include a plurality of layers. Each respective layer of the plurality layers may define a respective window edge of a plurality of window edges. The plurality of window edges may define an optical window configured to transmit light through the optical filter. At least a first respective window edge of the plurality of window edges may be stepped relative to at least a second respective window edge of the plurality of window edges.