公开(公告)号：US20240040760A1

公开(公告)日：2024-02-01

申请号：US18265597

申请日：2021-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Yuan Zhao ,  Zhiyong Xu ,  Ju Le Sun

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/24

CPC classification number: H05K9/0084 ,  H05K1/0216 ,  H05K3/241 ,  H05K2201/0707

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.

公开(公告)号：US12245411B2

公开(公告)日：2025-03-04

申请号：US18265597

申请日：2021-11-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chao Yang ,  Yuan Zhao ,  Zhiyong Xu ,  Ju Le Sun

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/24

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.

公开(公告)号：US20220153987A1

公开(公告)日：2022-05-19

申请号：US17593250

申请日：2019-12-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Lingjie Tong ,  Yuan Zhao ,  Li Yao ,  Shuang Wu ,  Xiaohai Sheng ,  Xinxin Sun ,  Ahmad Shaaban ,  Menghuang Feng

IPC: C08L63/00 ,  C08K3/013 ,  C08G59/68 ,  C08K5/37

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 40 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises ether in the backbone thereof.