EXPANDABLE RUBBER-MODIFIED STYRENE POLYMER, ITS PRODUCTION, AND PRE-EXPANDED BEAD

    公开(公告)号:JPH10310675A

    公开(公告)日:1998-11-24

    申请号:JP10742498

    申请日:1998-04-17

    Applicant: BASF AG

    Abstract: PROBLEM TO BE SOLVED: To provide an expandable rubber-modified styrene polymer showing improved elasticity recovery, by incorporating a low-boiling blowing agent in a polymer mixture comprising a continuous phase of a styrene copolymer and rubber particles dispersed therein and comprising a butadiene/styrene block copolymer, and having a lamella structure free from polystyrene. SOLUTION: The expandable styrene polymer contains desirably 85-93 wt.% polystyrene or styrene copolymer (containing up to 50 wt.%, desirably up to 80 wt.% comonomer). The polystyrene contains a small amount (0.005-0.05 mol based on the styrene) of a crosslinking agent to be copolymerized. The expandable styrene polymer is desirably one containing 5-30 wt.% butadiene/styrene block copolymer in the polymer mixture and dispersed in the polystyrene phase in the form of particles. The ratio of the average length 1 of the rubber particles to the average thickness d is desirably above 5/1. The mixture contains 2-15 pts.wt., based on the composition, low-boiling blowing agent.

    Transparent mixture of linear styrene-butadiene block copolymer
    5.
    发明专利
    Transparent mixture of linear styrene-butadiene block copolymer 有权
    线性苯乙烯 - 丁二烯嵌段共聚物的透明混合物

    公开(公告)号:JP2006169522A

    公开(公告)日:2006-06-29

    申请号:JP2005355863

    申请日:2005-12-09

    Abstract: PROBLEM TO BE SOLVED: To provide a transparent mixture comprising a styrene-butadiene block copolymer and a polystyrene, which has high toughness and excellent transparency even when the polystyrene content in the mixture is relatively high, wherein the above-noted properties have been obtained by avoiding conventional disadvantages. SOLUTION: This mixture comprises a linear block copolymer comprising a vinyl aromatic monomer and a diene, which has structures of (I) S 1 -B 1 -S 2 and (II) B 2 -S 3 , wherein S 1 represents a block comprising a vinyl aromatic monomer having a number average molecular weight (Mn) of in a range of from 40,000 to 100,000 g/mol; S 2 and S 3 respectively represent a block comprising a vinyl aromatic monomer having a number average molecular weight (Mn) of in a range of from 5,000 to 20,000 g/mol; and B 1 and B 2 respectively represent either one or more block comprising a diene, or a block of a copolymer comprising a diene and a vinyl aromatic monomer having a number average molecular weight (Mn) of in a range of from 15,000 to 100,000 g/mol, and wherein the ratio of (I)/(II) in the block copolymer is in a range of from 0.5 to 10. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:为了提供包含苯乙烯 - 丁二烯嵌段共聚物和聚苯乙烯的透明混合物,即使当混合物中的聚苯乙烯含量相对较高时,其具有高韧性和优异的透明性,其中上述性质具有 通过避免常规缺点得到。 解决方案:该混合物包含包含乙烯基芳族单体和二烯的线性嵌段共聚物,其具有(I)S 1 -S < SB> 2 和(II)B -S 3 ,其中S 1 表示包含乙烯基芳族单体的嵌段, 数均分子量(Mn)在40,000至100,000g / mol的范围内; S 2 和S 3 分别表示包含数均分子量(Mn)在5,000至20,000g / mol范围内的乙烯基芳族单体的嵌段; 和B 1 和B 2 分别表示一个或多个包含二烯的嵌段或包含二烯和包含数均分子量的乙烯基芳族单体的共聚物嵌段 重量(Mn)在15,000至100,000g / mol的范围内,并且其中嵌段共聚物中的(I)/(II)的比率在0.5至10的范围内。 )2006年,日本特许厅和NCIPI

    THERMOPLASTIC MOULDING MATERIAL
    10.
    发明申请
    THERMOPLASTIC MOULDING MATERIAL 审中-公开
    热塑性材料

    公开(公告)号:WO9534586A3

    公开(公告)日:1996-02-08

    申请号:PCT/EP9502072

    申请日:1995-05-31

    CPC classification number: C08F212/32 C08F297/02

    Abstract: PCT No. PCT/EP95/02072 Sec. 371 Date Dec. 16, 1996 Sec. 102(e) Date Dec. 16, 1996 PCT Filed May 31, 1995 PCT Pub. No. WO95/34586 PCT Pub. Date Dec. 21, 1995Thermoplastic molding compounds comprise as essential components A) from 10 to 100% by weight of copolymers of the monomers of the general formulae I and II I II where R1 is H or alkyl of 1-22 carbon atoms, R2 is H or alkyl of 1-22 carbon atoms, R3 is H or alkyl of 1-4 carbon atoms, a is 0, 1, 2, 3, 4 or 5, and b is 0, 1, 2, 3, 4 or 5, B) from 0 to 3000 ppm, based on the weight of component A, of compounds of the general formula I, C) from 0 to 500 ppm, based on the weight of component A, of compounds of the general formula II, D) from 0 to 90% by weight, based on the total weight of the molding compound, of polymers other than A), and E) from 0 to 50% by weight, based on the total weight of the molding compound, of additives and processing aids.

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