Abstract:
The invention relates to a method for producing polymer-coated metal foils, comprising the following steps: (a) a base layer (7) is applied to a carrier foil (3) by means of a dispersion (5) containing particles that can be electroless-plated or electroplated in a matrix material; (b) the matrix material is at least partially dried and/or at least partially hardened; (c) a metal layer (19) is formed on the base layer (7) by subjecting the base layer (7) containing the particles that can be electroless-plated or electroplated to an electroless plating or electroplating process; (d) a polymer (23) is applied to the metal layer (19). The invention further relates to a use of the polymer-coated metal foil produced according to the invention for manufacturing printed circuit boards.
Abstract:
The invention relates to a method for producing polymer-coated metal foils, comprising the following steps: (a) applying a base layer (7) onto a support foil (3), with a dispersion (5) which comprises electrolessly and/or electrolytically coatable particles in a matrix material, (b) at least partially drying and/or at least partially curing the matrix material, (c) forming a metal layer (19) on the base layer (7) by electroless and/or electrolytic coating of the base layer (7) comprising the electrolessly or electrolytically coatable particles, (d) applying a polymer (23) to the metal layer (19). Furthermore, the invention relates to a use of the polymer-coated metal foil for the production of printed circuit boards.
Abstract:
Method for producing electrically conductive, structured or full-area surfaces on a support, in which a structured or full-area base layer onto the support in a first step by using a dispersion, which contains electrically conductive particles in a matrix material, the matrix material is at least partially cured and/or dried in a second step, the electrically conductive particles are exposed in a third step by at least partially breaking the matrix, and a metal layer is formed on the structured or full-area base layer in a fourth step by electroless and/or electrolytic coating.
Abstract:
The invention relates to a method for producing metal-coated base laminates having a support (51) made of an electrically nonconductive material (37), which is coated on at least one side with a metal layer (25, 53). In a first step, a base layer (11) is applied onto a substrate (3) with a dispersion (5), which contains electrolessly and/or electrolytically coatable particles in a matrix material. The matrix material is at least partially cured and/or dried. A metal layer is subsequently formed on the base layer (11) by electroless and/or electrolytic coating. The support (51) made of the electrically nonconductive material (37) is laminated onto the metal layer (25). The support (51) laminated with the metal layer (25) and at least a part of the base layer (11) are subsequently removed from the substrate (3).
Abstract:
The invention relates to a method for the production of metal-coated base laminates having a carrier (51) made of an electrically non-conductive mate rial (37) that is coated on at least one side with a metal coating (25, 53). In a first step, a base coating (11) is applied onto a substrate (3) having a dispersion (5) containing particles in a matrix material that can be coat ed in a current-free and/or galvanized manner. The matrix material is at lea st partially cured and/or dried. A metal coating is subsequently formed on t he base coating (11) by means of a current-free and/or galvanic coating. The carrier (51) made of the electrically non-conductive material (37) is lamin ated onto the metal coating (25). As a final step, the carrier (51) is remov ed from the substrate (3) along with the metal coating (25) laminated thereo n and at least part of the base coating (11).
Abstract:
Method for producing electrically conductive, structured or whole-area su rfaces on a carrier, in which a first step involves applying a structured or whole-area base layer to the carrier with a dispersion containing electrica lly conductive particles in a matrix material, a second step involves at lea st partly curing or drying the matrix material, a third step involves uncove ring the electrically conductive particles by at least partly breaking up th e matrix, and a fourth step involves forming a metal layer on the structured or whole-area base layer by means of electroless or electrolytic coating.
Abstract:
The invention relates to a method for producing structured, electrically-conductive surfaces (3, 11) on an electrically nonconductive support (1), in which the structured and/or full-area electrically-conductive surfaces (3) of a first plane are applied onto the support (1) in a first step, an insulating layer (9) is applied in a second step at the positions where structured and/or full-area electrically-conductive surfaces (11) of a second plane cross the structured and/or full-area electrically-conductive surfaces (3) of the first plane and no electrical contact is intended to take place between the structured and/or full-area electrically-conductive surfaces of the first plane (3) and of the second plane (11), in a third step the structured and/or full-area electrically-conductive surfaces (11) of the second plane are applied according to the first step, and the second and third steps are optionally repeated.
Abstract:
The invention relates to a method for producing polymer-coated metal foil s, comprising the following steps: (a) a base layer (7) is applied to a carr ier foil (3) by means of a dispersion (5) containing particles that can be e lectroless-plated or electroplated in a matrix material; (b) the matrix mate rial is at least partially dried and/or at least partially hardened; (c) a m etal layer (19) is formed on the base layer (7) by subjecting the base layer (7) containing the particles that can be electroless-plated or electroplate d to an electroless plating or electroplating process; (d) a polymer (23) is applied to the metal layer (19). The invention further relates to a use of the polymer-coated metal foil produced according to the invention for manufa cturing printed circuit boards.