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    RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME
    2.
    发明申请
    RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAME 审中-公开
    活动电气插件，包括插入器的系统及其使用和形成方法

    公开(公告)号：WO2012061568A3

    公开(公告)日：2014-04-10

    申请号：PCT/US2011059091

    申请日：2011-11-03

    Applicant: CASCADE MICROTECH INC ,  SMITH KENNETH R ,  JOLLEY MIKE ,  STRID ERIC ,  HANAWAY PETER ,  GLEASON K REED ,  DUCKWORTH KOBY L

    Inventor： SMITH KENNETH R ,  JOLLEY MIKE ,  STRID ERIC ,  HANAWAY PETER ,  GLEASON K REED ,  DUCKWORTH KOBY L

    IPC: G01R31/00

    CPC classification number: G01R1/0735 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/4857 ,  Y10T29/49155

    Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

    Abstract translation: 可用于在第一装置和第二装置之间形成多个电连接的弹性电插入件，以及可利用弹性电插入件及其使用和/或制造方法的系统。 弹性电插入件可以包括弹性介电体，其中包含多个电导管。 多个电导管可以被配置为在电插入器的第一表面和/或弹性电介质体之间提供多个电连接以及电插入器和/或弹性介电体的第二相对的表面。 本文公开的系统和方法可以提供弹性电插入器的改进的垂直顺应性，改进的接触力控制和/或改进的尺寸稳定性。

    HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME
    3.
    发明申请
    HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME 审中-公开
    高频互连结构，利用高频互联结构的电子组件及其操作方法

    公开(公告)号：WO2012167014A2

    公开(公告)日：2012-12-06

    申请号：PCT/US2012040366

    申请日：2012-06-01

    Applicant: CASCADE MICROTECH INC ,  STRID ERIC W ,  CAMPBELL RICHARD L ,  SMITH KENNETH R ,  GLEASON K REED ,  JUNG KOOHO

    Inventor： STRID ERIC W ,  CAMPBELL RICHARD L ,  SMITH KENNETH R ,  GLEASON K REED ,  JUNG KOOHO

    IPC: H01P5/12

    CPC classification number: G01R23/02 ,  H01P3/16 ,  H01P3/18

    Abstract: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.

    Abstract translation: 高频互连结构，利用高频互连结构的电子组件及其操作方法。 高频互连结构包括多个介质波导，并且被配置为将多个发射器与多个接收器通信连接并且在其间传送多个信号。 多个信号可以包括多个电磁波，并且可以具有至少200GHz的频率。 高频互连结构还可以被配置为降低由多个介质波导的第一介电波导传送的第一信号与由多个介质波导的第二介质波导传送的第二信号之间的串扰的电位 波导，例如通过控制第一介电波导相对于第二介质波导的通带和/或使用串扰减轻结构。

    4.
    发明专利
    未知

    公开(公告)号：DE69322206D1

    公开(公告)日：1999-01-07

    申请号：DE69322206

    申请日：1993-05-20

    Applicant: CASCADE MICROTECH INC

    Inventor： SCHWINDT RANDY J ,  HARWOOD WARREN K ,  TERVO PAUL A ,  SMITH KENNETH R ,  WARNER RICHARD H ,  ANDREWS PETER D

    IPC: H01L21/66 ,  A46D1/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  H01L21/687 ,  H01L21/00

    Abstract: A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly (20) which consists of at least three chuck assembly elements (80, 81, 83). A first element (80) supports the test device, while an underlying second element (81) acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element (83). Ready-to-use, selectively detachable electrical connector assemblies (108, 110) provide for signal and guard connections to the first and second chuck assembly elements (80, 81) respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements (80, 81, 83) is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors (128, 130) for individually-positionable probes (30) provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.

    6.
    发明专利
    未知

    公开(公告)号：DE69322206T2

    公开(公告)日：1999-04-22

    申请号：DE69322206

    申请日：1993-05-20

    Applicant: CASCADE MICROTECH INC

    Inventor： SCHWINDT RANDY J ,  HARWOOD WARREN K ,  TERVO PAUL A ,  SMITH KENNETH R ,  WARNER RICHARD H ,  ANDREWS PETER D

    IPC: H01L21/66 ,  A46D1/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  H01L21/687 ,  H01L21/00

    Abstract: A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly (20) which consists of at least three chuck assembly elements (80, 81, 83). A first element (80) supports the test device, while an underlying second element (81) acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element (83). Ready-to-use, selectively detachable electrical connector assemblies (108, 110) provide for signal and guard connections to the first and second chuck assembly elements (80, 81) respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements (80, 81, 83) is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors (128, 130) for individually-positionable probes (30) provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.

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