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    PROBE STATION THERMAL CHUCK FOR SHIELDING CAPACITANCE CURRENT
    1.
    发明专利
    PROBE STATION THERMAL CHUCK FOR SHIELDING CAPACITANCE CURRENT 失效

    公开(公告)号：JP2001068515A

    公开(公告)日：2001-03-16

    申请号：JP2000197550

    申请日：2000-06-30

    Applicant: CASCADE MICROTECH INC

    Inventor： COWAN CLARENCE E ,  TERVO PAUL A ,  DUNKLEE JOHN L

    IPC: G01R31/26 ,  G01R1/06 ,  G01R1/18 ,  G01R31/28 ,  H01L21/66 ,  H01L35/00 ,  H01L35/32

    Abstract: PROBLEM TO BE SOLVED: To reduce noises caused by a capacitance current and affecting test and measurement to a value less than an allowable value by shielding the capacitance current produced by a thermal unit for changing the temperature of a chuck for supporting a device, in a probe station for testing and measuring an integrated circuit device. SOLUTION: This thermal chuck includes a chuck 4 for supporting a device during testing, a thermal unit for changing the temperature of the chuck 4, and a conductive member which is connected to the thermal unit as a capacitance but is not in direct electrical contact therewith. The conductive member is connected electrically to a controller 18 for supplying electricity to the thermal unit and provides a conductive passage for taking almost all the capacitance current generated by the operation of the thermal unit and flowing the current to the controller 18. In order to take the capacitance current generated by the conductive member and to flow the current to a ground outside the closed box 2, the expansion portion of the environment closed box 2 of the probe station is coupled capacitatively to the conductive member.

    6.
    发明专利
    未知

    公开(公告)号：DE69322206T2

    公开(公告)日：1999-04-22

    申请号：DE69322206

    申请日：1993-05-20

    Applicant: CASCADE MICROTECH INC

    Inventor： SCHWINDT RANDY J ,  HARWOOD WARREN K ,  TERVO PAUL A ,  SMITH KENNETH R ,  WARNER RICHARD H ,  ANDREWS PETER D

    IPC: H01L21/66 ,  A46D1/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  H01L21/687 ,  H01L21/00

    Abstract: A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly (20) which consists of at least three chuck assembly elements (80, 81, 83). A first element (80) supports the test device, while an underlying second element (81) acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element (83). Ready-to-use, selectively detachable electrical connector assemblies (108, 110) provide for signal and guard connections to the first and second chuck assembly elements (80, 81) respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements (80, 81, 83) is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors (128, 130) for individually-positionable probes (30) provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.

    7.
    发明专利
    未知

    公开(公告)号：DE69302215T2

    公开(公告)日：1996-09-19

    申请号：DE69302215

    申请日：1993-05-20

    Applicant: CASCADE MICROTECH INC

    Inventor： HARWOOD WARREN K ,  TERVO PAUL A ,  WARNER RICHARD H

    IPC: G01R31/26 ,  G01R1/067 ,  H01L21/66 ,  H01L21/683 ,  H01L21/00

    Abstract: A wafer probe station has a wafer-supporting vacuum chuck (80), together with one or more substrate-supporting auxiliary vacuum chucks (92,94) having independent vacuum controls for mounting contact substrates and calibration substrates simultaneously with the wafer. A detachable interconnection of the various chucks enables independent replacement of each chuck to accommodate various different chuck types, and also permits the elevations of the respective chuck surfaces (82,100,102) to be adjusted relative to each other to compensate for differences in thicknesses between the wafer substrate and the calibration or contact substrates. The invention is especially useful in wafer probe stations equipped with enclosures (42,44) for controlled-environment testing where a large variety of different wafer chucks (80) must be readily interchangeable for testing under different conditions.

    9.
    发明专利
    未知

    公开(公告)号：DE69322206D1

    公开(公告)日：1999-01-07

    申请号：DE69322206

    申请日：1993-05-20

    Applicant: CASCADE MICROTECH INC

    Inventor： SCHWINDT RANDY J ,  HARWOOD WARREN K ,  TERVO PAUL A ,  SMITH KENNETH R ,  WARNER RICHARD H ,  ANDREWS PETER D

    IPC: H01L21/66 ,  A46D1/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/02 ,  G01R31/28 ,  H01L21/687 ,  H01L21/00

    Abstract: A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly (20) which consists of at least three chuck assembly elements (80, 81, 83). A first element (80) supports the test device, while an underlying second element (81) acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element (83). Ready-to-use, selectively detachable electrical connector assemblies (108, 110) provide for signal and guard connections to the first and second chuck assembly elements (80, 81) respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements (80, 81, 83) is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors (128, 130) for individually-positionable probes (30) provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.

    10.
    发明专利
    未知

    公开(公告)号：DE69302215D1

    公开(公告)日：1996-05-23

    申请号：DE69302215

    申请日：1993-05-20

    Applicant: CASCADE MICROTECH INC

    Inventor： HARWOOD WARREN K ,  TERVO PAUL A ,  WARNER RICHARD H

    IPC: G01R31/26 ,  G01R1/067 ,  H01L21/66 ,  H01L21/683 ,  H01L21/00

    Abstract: A wafer probe station has a wafer-supporting vacuum chuck (80), together with one or more substrate-supporting auxiliary vacuum chucks (92,94) having independent vacuum controls for mounting contact substrates and calibration substrates simultaneously with the wafer. A detachable interconnection of the various chucks enables independent replacement of each chuck to accommodate various different chuck types, and also permits the elevations of the respective chuck surfaces (82,100,102) to be adjusted relative to each other to compensate for differences in thicknesses between the wafer substrate and the calibration or contact substrates. The invention is especially useful in wafer probe stations equipped with enclosures (42,44) for controlled-environment testing where a large variety of different wafer chucks (80) must be readily interchangeable for testing under different conditions.

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