CRYSTAL VIBRATION DEVICE
    6.
    发明公开
    CRYSTAL VIBRATION DEVICE 有权
    晶体谐振器

    公开(公告)号:EP1187323A4

    公开(公告)日:2005-04-06

    申请号:EP01908254

    申请日:2001-03-02

    Applicant: DAISHINKU CORP

    CPC classification number: H03H9/0509 H03H9/0519 H03H9/131

    Abstract: A crystal vibration device comprising a crystal diaphragm formed on the opposite main surfaces thereof with exciting electrodes and extraction electrodes extracted from respective exciting electrodes, and an electrode pad formed on a base and electrically connected with the crystal diaphragm via a silicon-based conductive adhesive. Each of at least extraction electrodes, out of the exciting electrodes and the extraction electrodes, comprises a Cr film layer, an Au film layer, and a Cr thin film layer or an Ag thin film layer sequentially laminated on the crystal diaphragm. The electrode pad comprises a tungsten- or molybdenum-made metallized layer, a Ni film layer and an Au film layer sequentially laminated on the base, and at least a specified region, to which a silicon conductive adhesive is applied, in the Au film layer of the electrode pad is diffused with Ni in the Ni film layer.

    PIEZOELECTRIC OSCILLATION DEVICE
    7.
    发明公开
    PIEZOELECTRIC OSCILLATION DEVICE 审中-公开
    压电振动

    公开(公告)号:EP3086471A4

    公开(公告)日:2017-04-12

    申请号:EP14870753

    申请日:2014-12-04

    Applicant: DAISHINKU CORP

    Abstract: A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation and reduce the size or height. A crystal resonator 101 includes a crystal resonator plate 2, a first sealing member 3 and a second sealing member 4. A sealing-member-side first bonding pattern 321 and a sealing-member-side second bonding pattern 421, both to be bonded to the crystal resonator plate 2, are formed respectively on the first sealing member 3 and the second sealing member 4. On the crystal resonator plate 2, a resonator-plate-side first bonding pattern 251 to be bonded to the first sealing member 3 is formed on a first main surface 211 and a resonator-plate-side second bonding pattern 252 to be bonded to the second sealing member 4 is formed on a second main surface 212. The sealing-member-side first bonding pattern 321 is bonded to the resonator-plate-side first bonding pattern 251, and the sealing-member-side second bonding pattern 421 is bonded to the resonator-plate-side second bonding pattern 252, both by diffusion bonding.

    Piezoelectric vibration device
    8.
    发明专利
    Piezoelectric vibration device 审中-公开
    压电振动装置

    公开(公告)号:JP2013168893A

    公开(公告)日:2013-08-29

    申请号:JP2012032249

    申请日:2012-02-17

    Inventor: IIZUKA MINORU

    Abstract: PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device which improves hermetic sealing performance of a package and facilitates the characteristic improvements.SOLUTION: In a surface mounted crystal oscillator, a crystal diaphragm 2 is housed in a base and is hermetically sealed by a lid and an IC 4 for an oscillation circuit is mounted. The base has a cavity C opening at the lower side. A step part 111 is formed into a rectangular peripheral shape in the cavity so as to be spaced a given depth dimension away from the opening of the cavity C. The lid is joined to the upper surface of the step part by a brazing material 31. A lower portion (the opening side) 11a of a side wall part 11 is formed so as to be thinner than the step part, and external terminals 14 are formed at four corners of a base bottom surface.

    Abstract translation: 要解决的问题:提供一种提高封装的气密密封性能并促进特性改进的压电振动装置。解决方案:在表面安装的晶体振荡器中,将晶体振动膜2容纳在基座中并用盖子气密密封 并安装用于振荡电路的IC 4。 基座在下侧开有空腔C。 台阶部分111在空腔中形成为矩形周边形状,以便与空腔C的开口间隔开给定的深度尺寸。盖通过钎焊材料31接合到台阶部分的上表面。 侧壁部11的下部(开口侧)11a形成为比台阶部更薄,外部端子14形成在底部底面的四角。

    Manufacturing method of piezoelectric vibration device
    9.
    发明专利
    Manufacturing method of piezoelectric vibration device 有权
    压电振动装置的制造方法

    公开(公告)号:JP2012257152A

    公开(公告)日:2012-12-27

    申请号:JP2011130085

    申请日:2011-06-10

    Abstract: PROBLEM TO BE SOLVED: To shorten the time to perform the airtight inspection of a piezoelectric vibration device in a manufacturing of the piezoelectric vibration device.SOLUTION: A manufacturing apparatus 7 of a crystal resonator 1 is provided with: a hermetic sealing chamber 73 heat-joining a base 3 to a lid 4 under the vacuum atmosphere to form an internal space 12 which is in a vacuum state and hermetically sealing a crystal vibration piece 2 in the internal space 12; and an inspection chamber 75 inspecting the airtight state of the internal space 12 of the crystal resonator 1 under the vacuum atmosphere. The manufacturing apparatus 7 transfers the crystal resonator 1 to the hermetic sealing chamber 73 and then to the inspection chamber 75.

    Abstract translation: 解决的问题:为了缩短压电振动装置的制造中对压电振动装置进行气密检查的时间。 解决方案:晶体谐振器1的制造装置7设置有:真空密封室73,其在真空气氛下将基座3加热到盖4以形成处于真空状态的内部空间12;以及 将水晶振动片2气密地密封在内部空间12中; 以及在真空气氛下检查晶体谐振器1的内部空间12的气密状态的检查室75。 制造装置7将晶体谐振器1传送到气密密封室73,然后传送到检查室75.版权所有(C)2013,JPO&INPIT

    Piezoelectric oscillation device
    10.
    发明专利
    Piezoelectric oscillation device 审中-公开
    压电振荡器件

    公开(公告)号:JP2009290273A

    公开(公告)日:2009-12-10

    申请号:JP2008137764

    申请日:2008-05-27

    Inventor: IIZUKA MINORU

    Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable piezoelectric oscillation device by improving impact resistance. SOLUTION: An elastic support having a buffer function in a three-dimensional direction is bonded to a base. On the holding part of the elastic support, a piezoelectric vibration plate is loaded in a flat state in the state that the main surface of both short sides of it is held. A conductive bonding material S is applied to the diagonal position of both short sides of the piezoelectric vibration plate, and is conductively bonded with the elastic support. Relative to the short side length W of the piezoelectric vibration plate, the length Ws of the conductive bonding material is set to the length of about 30%. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:通过提高耐冲击性来提供高可靠性的压电振荡装置。 解决方案:具有在三维方向上具有缓冲功能的弹性支撑体结合到基底。 在弹性支撑体的保持部分上,压电振动板在保持其两个短边的主表面的状态下被加载成平坦状态。 导电接合材料S被施加到压电振动板的两个短边的对角位置,并且与弹性支撑件导电地接合。 相对于压电振动板的短边长度W,导电性接合材料的长度Ws设定为约30%的长度。 版权所有(C)2010,JPO&INPIT

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