Title translation:BASISFÜREINOBERFLÄCHENMONTIERTESPAKET ZUR VERWENDUNG ELEKTRONISCHER KOMPONENTEN SOWIEOBERFLÄCHENMONTIERTESPAKET ZUR VERWENDUNG ELEKTRONISCHER KOMPONENTEN
Abstract:
A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal. The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.
Abstract:
A crystal vibration device comprising a crystal diaphragm formed on the opposite main surfaces thereof with exciting electrodes and extraction electrodes extracted from respective exciting electrodes, and an electrode pad formed on a base and electrically connected with the crystal diaphragm via a silicon-based conductive adhesive. Each of at least extraction electrodes, out of the exciting electrodes and the extraction electrodes, comprises a Cr film layer, an Au film layer, and a Cr thin film layer or an Ag thin film layer sequentially laminated on the crystal diaphragm. The electrode pad comprises a tungsten- or molybdenum-made metallized layer, a Ni film layer and an Au film layer sequentially laminated on the base, and at least a specified region, to which a silicon conductive adhesive is applied, in the Au film layer of the electrode pad is diffused with Ni in the Ni film layer.
Abstract:
A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation and reduce the size or height. A crystal resonator 101 includes a crystal resonator plate 2, a first sealing member 3 and a second sealing member 4. A sealing-member-side first bonding pattern 321 and a sealing-member-side second bonding pattern 421, both to be bonded to the crystal resonator plate 2, are formed respectively on the first sealing member 3 and the second sealing member 4. On the crystal resonator plate 2, a resonator-plate-side first bonding pattern 251 to be bonded to the first sealing member 3 is formed on a first main surface 211 and a resonator-plate-side second bonding pattern 252 to be bonded to the second sealing member 4 is formed on a second main surface 212. The sealing-member-side first bonding pattern 321 is bonded to the resonator-plate-side first bonding pattern 251, and the sealing-member-side second bonding pattern 421 is bonded to the resonator-plate-side second bonding pattern 252, both by diffusion bonding.
Abstract:
PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device which improves hermetic sealing performance of a package and facilitates the characteristic improvements.SOLUTION: In a surface mounted crystal oscillator, a crystal diaphragm 2 is housed in a base and is hermetically sealed by a lid and an IC 4 for an oscillation circuit is mounted. The base has a cavity C opening at the lower side. A step part 111 is formed into a rectangular peripheral shape in the cavity so as to be spaced a given depth dimension away from the opening of the cavity C. The lid is joined to the upper surface of the step part by a brazing material 31. A lower portion (the opening side) 11a of a side wall part 11 is formed so as to be thinner than the step part, and external terminals 14 are formed at four corners of a base bottom surface.
Abstract:
PROBLEM TO BE SOLVED: To shorten the time to perform the airtight inspection of a piezoelectric vibration device in a manufacturing of the piezoelectric vibration device.SOLUTION: A manufacturing apparatus 7 of a crystal resonator 1 is provided with: a hermetic sealing chamber 73 heat-joining a base 3 to a lid 4 under the vacuum atmosphere to form an internal space 12 which is in a vacuum state and hermetically sealing a crystal vibration piece 2 in the internal space 12; and an inspection chamber 75 inspecting the airtight state of the internal space 12 of the crystal resonator 1 under the vacuum atmosphere. The manufacturing apparatus 7 transfers the crystal resonator 1 to the hermetic sealing chamber 73 and then to the inspection chamber 75.
Abstract:
PROBLEM TO BE SOLVED: To provide a highly reliable piezoelectric oscillation device by improving impact resistance. SOLUTION: An elastic support having a buffer function in a three-dimensional direction is bonded to a base. On the holding part of the elastic support, a piezoelectric vibration plate is loaded in a flat state in the state that the main surface of both short sides of it is held. A conductive bonding material S is applied to the diagonal position of both short sides of the piezoelectric vibration plate, and is conductively bonded with the elastic support. Relative to the short side length W of the piezoelectric vibration plate, the length Ws of the conductive bonding material is set to the length of about 30%. COPYRIGHT: (C)2010,JPO&INPIT