公开(公告)号：US20240256290A1

公开(公告)日：2024-08-01

申请号：US18630155

申请日：2024-04-09

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jared Johnson ,  Robert Mascia

IPC: G06F9/4401 ,  G01R19/165 ,  G06F1/28 ,  G06F11/30 ,  G06F11/34 ,  G11C11/406 ,  H02H3/247

CPC classification number: G06F9/442 ,  G01R19/1658 ,  G06F1/28 ,  G06F11/3058 ,  G06F11/3495 ,  G11C11/406 ,  H02H3/247

Abstract: A technique for managing undervoltage in a compute system is disclosed. The technique includes a method that further includes: detecting an AC undervoltage condition in the compute system; and upon detecting the AC undervoltage condition: dynamically determining a holdup time as a function of the present load; determining a monitoring period as a function of the dynamically determined holdup time; waiting for the determined monitoring period to expire; and upon expiration of the determined monitoring period, perform a shutdown process if the AC undervoltage condition persists.

公开(公告)号：US20220357956A1

公开(公告)日：2022-11-10

申请号：US17316352

申请日：2021-05-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jared Johnson ,  Robert Mascia

IPC: G06F9/4401 ,  G06F11/30 ,  G06F11/34 ,  G06F1/28 ,  G11C11/406 ,  H02H3/247 ,  G01R19/165

Abstract: A technique for managing undervoltage in a compute system is disclosed. The technique includes a method that further includes: detecting an AC undervoltage condition in the compute system; and upon detecting the AC undervoltage condition: dynamically determining a holdup time as a function of the present load; determining a monitoring period as a function of the dynamically determined holdup time; waiting for the determined monitoring period to expire; and upon expiration of the determined monitoring period, perform a shutdown process if the AC undervoltage condition persists.

公开(公告)号：US10955883B1

公开(公告)日：2021-03-23

申请号：US16653335

申请日：2019-10-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Robert Mascia ,  Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: G06F1/20 ,  G06F1/26 ,  H05K7/20

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

公开(公告)号：US11977900B2

公开(公告)日：2024-05-07

申请号：US17316352

申请日：2021-05-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jared Johnson ,  Robert Mascia

IPC: G06F9/4401 ,  G01R19/165 ,  G06F1/28 ,  G06F11/30 ,  G06F11/34 ,  G11C11/406 ,  H02H3/247

CPC classification number: G06F9/442 ,  G01R19/1658 ,  G06F1/28 ,  G06F11/3058 ,  G06F11/3495 ,  G11C11/406 ,  H02H3/247

Abstract: A technique for managing undervoltage in a compute system is disclosed. The technique includes a method that further includes: detecting an AC undervoltage condition in the compute system; and upon detecting the AC undervoltage condition: dynamically determining a holdup time as a function of the present load; determining a monitoring period as a function of the dynamically determined holdup time; waiting for the determined monitoring period to expire; and upon expiration of the determined monitoring period, perform a shutdown process if the AC undervoltage condition persists.

公开(公告)号：US20210109574A1

公开(公告)日：2021-04-15

申请号：US16653335

申请日：2019-10-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Robert Mascia ,  Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: G06F1/20 ,  G06F1/26 ,  H05K7/20

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.