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    STAMP DEVICE WHICH PRINTS PATTERN ON SURFACE OF SUBSTRATE
    1.
    发明专利
    STAMP DEVICE WHICH PRINTS PATTERN ON SURFACE OF SUBSTRATE 失效

    公开(公告)号：JP2001205909A

    公开(公告)日：2001-07-31

    申请号：JP2000396889

    申请日：2000-12-27

    Applicant: IBM

    Inventor： BRUNO MICHEL ,  SCHMIDT HEINZ ,  DELAMARCHE EMMANUEL ,  BIETSCH ALEXANDER

    IPC: B41K1/02 ,  B41K3/00 ,  B41K3/04 ,  B41M1/02 ,  B41N10/04 ,  G03F7/00

    Abstract: PROBLEM TO BE SOLVED: To perform a printing of a large area, which is mechanized, regarding a stamp device which prints a pattern on the surface of a substrate. SOLUTION: This stamp device which prints a pattern on the surface of the substrate 4 is equipped with a carrier layer 1 having rigidity. The carrier layer 1 is equipped with a first surface and a second surface. On the first surface, a layer 3 on which the pattern is formed, made of a first material, is provided. On the second surface, a soft layer 5 made of a material which is softer than the first material is provided. The layer 3 on which the pattern is formed and the soft layer 5 function while cooperating, and even when a contact surface formed between the stamp and the substrate 4 is not accurately smooth and flat, a printing of a high quality is realized.

    METHOD FOR SELECTIVELY ETCHING SAM SUBSTRATE
    2.
    发明专利
    METHOD FOR SELECTIVELY ETCHING SAM SUBSTRATE 审中-公开

    公开(公告)号：JP2002294469A

    公开(公告)日：2002-10-09

    申请号：JP2002084108

    申请日：2002-03-25

    Applicant: IBM

    Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  MICHEL BRUNO ,  SCHMIDT HEINZ

    IPC: C23F1/00 ,  C23F1/02 ,  C23F1/34 ,  C23F1/40 ,  H01L21/768

    Abstract: PROBLEM TO BE SOLVED: To provide a fine structure by etching a substrate having a region covered with self-assembly monomolecule(SAM). SOLUTION: A wet etching system for selectively forming a pattern on the substrate having the region covered with SAM and controlling an etching profile, includes (a) a fluid etching solution, and (b) additives having higher affinity for the region covered with the SAM than for the other region. The method for selectively forming the pattern on the substrate having the region covered with the SAM and controlling the etching profile, includes (a) a step of providing a fluid etching solution, (b) a step of adding the additives having the higher affinity for the region covered with SAM than for the other region to the above etching solution, and (c) a step of etching the above substrate with the above fluid etching solution containing the above additives.

    6.
    发明专利
    未知

    公开(公告)号：DE602004024585D1

    公开(公告)日：2010-01-21

    申请号：DE602004024585

    申请日：2004-08-23

    Applicant: IBM

    Inventor： BIETSCH ALEXANDER ,  MICHEL BRUNO

    IPC: H01L21/768 ,  G03F7/00 ,  H01L21/027

    Abstract: A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substrate on which the structure is to be formed and complementary recesses in the patterning of the stamp.

    9.
    发明专利
    未知

    公开(公告)号：AT451717T

    公开(公告)日：2009-12-15

    申请号：AT04744316

    申请日：2004-08-23

    Applicant: IBM

    Inventor： BIETSCH ALEXANDER ,  MICHEL BRUNO

    IPC: H01L21/768 ,  G03F7/00 ,  H01L21/027

    Abstract: A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substrate on which the structure is to be formed and complementary recesses in the patterning of the stamp.

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