公开(公告)号：EP1692717A4

公开(公告)日：2008-04-09

申请号：EP03819249

申请日：2003-12-08

Applicant: IBM

Inventor： BUEHRER FREDERICK WILLIAM ,  CHIDAMBARRAO DURESETI ,  DORIS BRUCE B ,  HUANG HSIANG-JEN ,  YANG HAINING

IPC: H01L21/336 ,  H01L21/22 ,  H01L21/265 ,  H01L21/324 ,  H01L21/425 ,  H01L21/8238 ,  H01L27/01 ,  H01L29/10 ,  H01L29/167 ,  H01L29/76

CPC classification number: H01L29/7842 ,  H01L21/22 ,  H01L21/26513 ,  H01L21/26586 ,  H01L21/324 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/1083 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7843

Abstract: A stressed film applied across a boundary defined by a structure or a body (e.g. substrate or layer ) of semiconductor material provides a change from tensile to compressive stress in the semiconductor material proximate to the boundary and is used to modify boron diffusion rate during annealing and thus modify final boron concentrations and/or profiles/gradients. In the case of a field effect transistor, the gate structure may be formed with or without sidewalls to regulate the location of the boundary relative to source/drain, extension and/or halo implants. Different boron diffusion rates can be produced in the lateral and vertical directions and diffusion rates comparable to arsenic can be achieved. Reduction of junction capacitance of both nFETs and pFETs can be achieved simultaneously with the same process steps.

Abstract translation: 施加在由半导体材料的结构或主体（例如衬底或层）限定的边界上的应力膜提供了在接近边界的半导体材料中从拉应力至压应力的变化，并且用于修改退火期间的硼扩散速率和 从而改变最终的硼浓度和/或分布/梯度。 在场效应晶体管的情况下，栅极结构可以形成为具有或不具有侧壁以相对于源极/漏极，延伸和/或晕圈注入来调节边界的位置。 可以在横向和垂直方向上产生不同的硼扩散速率，并且可以实现与砷相当的扩散速率。 可以通过相同的工艺步骤同时实现nFET和pFET的结电容的降低。

公开(公告)号：AU2003296359A1

公开(公告)日：2005-07-21

申请号：AU2003296359

申请日：2003-12-08

Applicant: IBM

Inventor： CHIDAMBARRAO DURESETI ,  DORIS BRUCE B ,  HUANG HSIANG-JEN ,  YANG HAINING ,  BUEHRER FREDERICK WILLIAM

IPC: H01L21/265 ,  H01L21/324 ,  H01L21/336 ,  H01L21/425 ,  H01L21/8238 ,  H01L27/01 ,  H01L29/10 ,  H01L29/167 ,  H01L29/76

Abstract: A stressed film applied across a boundary defined by a structure or a body (e.g. substrate or layer) of semiconductor material provides a change from tensile to compressive stress in the semiconductor material proximate to the boundary and is used to modify boron diffusion rate during annealing and thus modify final boron concentrations. In the case of a field effect transistor, the gate structure may be formed with or without sidewalls to regulate the location of the boundary relative to source/drain, extension and/or halo implants. Different boron diffusion rates can be produced in the lateral and vertical directions and diffusion rates comparable to arsenic can be achieved. Reduction of junction capacitance of both nFETs and pFETs can be achieved simultaneously with the same process steps.