1.
    发明专利
    未知

    公开(公告)号:DE602004022435D1

    公开(公告)日:2009-09-17

    申请号:DE602004022435

    申请日:2004-08-20

    Applicant: IBM

    Abstract: A structure and method for a metal replacement gate of a high performance device is provided. A sacrificial gate structure is first formed on an etch stop layer provided on a semiconductor substrate. A pair of spacers is provided on sidewalls of the sacrificial gate structure. The sacrificial gate structure is then removed, forming an opening. Subsequently, a metal gate including an first layer of metal such as tungsten, a diffusion barrier such as titanium nitride, and a second layer of metal such as tungsten is formed in the opening between the spacers.

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