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公开(公告)号:WO02099873A3
公开(公告)日:2003-09-18
申请号:PCT/EP0205282
申请日:2002-05-14
Applicant: IBM , IBM DEUTSCHLAND
Inventor: AGARWALA BIRENDRA N , COKER ERIC M , CORREALE ANTHONY JR , RATHORE HAZARA S , SULLIVAN TIMOTHY D
IPC: H01L21/768 , H01L23/522 , H01L23/532 , H01L23/528
CPC classification number: H01L21/76852 , H01L23/5226 , H01L23/528 , H01L23/5283 , H01L23/53223 , H01L23/53238 , H01L23/5329 , H01L23/53295 , H01L2924/0002 , H01L2924/00
Abstract: An interconnect structure, comprising: a lower level wire (200) having a side and a bottom, the lower level wire comprising: a lower core conductor (220) and a lower conductive liner (215), the lower conductive liner on the side and the bottom of the lower level wire; an upper level (205) wire having a side and a bottom, the upper level wire comprising an upper core conductor (230) and an upper conductive liner (225), the upper conductive liner on the side and the bottom of the upper level wire; and the upper conductive liner in contact with the lower core conductor and also in contact with the lower conductive liner in a liner-to-liner contact region (240A), (240B).
Abstract translation: 一种互连结构,包括:具有侧面和底部的下层导线(200),所述下层导线包括:下芯导体(220)和下导电衬套(215),所述下导电衬垫在侧面,以及 下层电线底部; 具有侧面和底部的上部电缆(205),所述上部电线包括上部芯导体(230)和上部导电衬垫(225),所述上部电线的侧面和底部上的上部导电衬垫 ; 并且所述上导电衬套与所述下芯导体接触并且还在衬套到衬垫接触区域(240A),(240B)中与所述下导电衬垫接触。
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公开(公告)号:AU2002314065A1
公开(公告)日:2002-12-16
申请号:AU2002314065
申请日:2002-05-14
Applicant: IBM
Inventor: COKER ERIC M , RATHORE HAZARA S , CORREALE ANTHONY JR , AGARWALA BIRENDRA N , SULLIVAN TIMOTHY D
IPC: H01L21/768 , H01L23/522 , H01L23/532 , H01L23/528
Abstract: A method for forming an interconnect structure, the interconnect structure comprising: a lower level wire having a side and a bottom, the lower level wire comprising: a lower core conductor and a lower conductive liner, the lower conductive liner on the side and the bottom of the lower level wire; an upper level wire having a side and a bottom, the upper level wire comprising an upper core conductor and an upper conductive liner, the upper conductive liner on the side and the bottom of the upper level wire; and the upper conductive liner in contact with the lower core conductor and also in contact with the lower conductive liner in a liner-to-liner contact region.
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