公开(公告)号：CA2676092A1

公开(公告)日：2008-12-18

申请号：CA2676092

申请日：2008-05-09

Applicant: IBM

Inventor： SIMONS ROBERT ,  CAMPBELL LEVI ,  ELLSWORTH MICHAEL JR ,  CHU RICHARD ,  IYENGAR MADHUSUDAN

IPC: F24F5/00 ,  F28D20/02

Abstract: A cooling system includes a facility cooling unit, a cooling tower, and o ne or more thermal capacitor units. The facility cooling unit, which include s a heat dissipation coolant loop, facilitates thermal energy extraction fro m a facility, such as a data center, for expelling of the energy to coolant within the heat dissipation coolant loop. The cooling tower is in fluid comm unication with the coolant loop, and includes a liquid-to-air heat exchanger for expelling thermal energy from coolant of the heat dissipation coolant l oop to the surrounding environment. The thermal capacitor unit is in fluid c ommunication with the heat dissipation coolant loop to facilitate efficient thermal energy transfer from coolant with in the coolant loop to the surroun ding environment with variation in ambient temperature about the cooling tow er.

公开(公告)号：CA2743110A1

公开(公告)日：2010-12-16

申请号：CA2743110

申请日：2010-05-11

Applicant: IBM

Inventor： SIMONS ROBERT ,  CAMPBELL LEVI ,  CHU RICHARD ,  IYENGAR MADHUSUDAN ,  ELLSWORTH MICHAEL JR

IPC: H05K7/20

Abstract: Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.