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1.发明申请
公开(公告)号：WO2007144264A2
公开(公告)日：2007-12-21
申请号：PCT/EP2007055260
申请日：2007-05-30
Applicant: IBM , IBM UK , CAMPBELL LEVI , CHU RICHARD , ELLSWORTH MICHAEL , FOGEL KEITH , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
Inventor： CAMPBELL LEVI , CHU RICHARD , ELLSWORTH MICHAEL , FOGEL KEITH , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
CPC classification number: H01L23/3677 , H01L2224/78301 , Y10T29/49128 , Y10T29/4935 , H01L2924/00014
Abstract: A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.
Abstract translation: 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并部分地延伸在较低热通量的第二区域上，其中第一和第二区域是待冷却表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。
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公开(公告)号：WO2007063064A2
公开(公告)日：2007-06-07
申请号：PCT/EP2006069003
申请日：2006-11-28
Applicant: IBM , IBM UK , CAMPBELL LEVI , CHU RICHARD , ELLSWORTH JR MICHAEL , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
Inventor： CAMPBELL LEVI , CHU RICHARD , ELLSWORTH JR MICHAEL , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
CPC classification number: H05K7/20772 , G06F1/20 , G06F2200/201
Abstract: A method and incorporated hybrid air and liquid cooled module for cooling electronic components of a computing system is disclosed. The module is used for cooling electronic components and comprise a closed loop liquid cooled assembly in thermal communication with an air cooled assembly, such that the air cooled assembly is at least partially included in the liquid cooled assembly.
Abstract translation: 公开了一种用于冷却计算系统的电子部件的方法和并入的混合式空气和液体冷却模块。 该模块用于冷却电子组件并且包括与空气冷却组件热连通的闭环液冷组件，使得空气冷却组件至少部分地包括在液冷组件中。
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公开(公告)号：DE112012004136B4
公开(公告)日：2018-11-29
申请号：DE112012004136
申请日：2012-10-23
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , CHU RICHARD , SIMONS ROBERT , ELLSWORTH MICHAEL , CAMPBELL LEVI , DAVID MILNES PAUL
Abstract: Kühleinheit, aufweisend: wenigstens eine Wärmeabführeinheit, die so konfiguriert ist, dass sie Wärme von einem Kühlmittel an die Luft abführt, das durch einen Kühlmittelkreislauf hindurchfließt und dabei durch die wenigstens eine Wärmeabführeinheit hindurchfließt, wobei die wenigstens eine Wärmeabführeinheit wenigstens eine Wärmetauscherbaugruppe aufweist, die mit dem Kühlmittelkreislauf verbunden ist, so dass wenigstens ein Teil des Kühlmittels durch ihn hindurchfließen kann, wobei eine Wärmetauscherbaugruppe der wenigstens einen Wärmetauscherbaugruppe der wenigstens einen Wärmeabführeinheit drehbar auf einer Tragvorrichtung montiert ist, und wobei die Kühleinheit des Weiteren einen Controller aufweist, der verbunden ist, um wenigstens einen Abschnitt der einen Wärmetauscherbaugruppe in Reaktion auf eine Änderung der Umgebungsluftstromrichtung an der einen Wärmetauscherbaugruppe automatisch zu drehen, um Abführen von Wärme, die über die eine Wärmetauscherbaugruppe strömt, an die Luft zu ermöglichen; und einen erhöht angeordneten Kühlmittelbehälter, der mittels Flüssigkeitsübertragung mit der wenigstens einen Wärmetauscherbaugruppe der wenigstens einen Wärmeabführeinheit verbunden ist, wobei der erhöht angeordnete Kühlmittelbehälter Rückführen des Kühlmittels an den Kühlmittelkreislauf bei einem im Wesentlichen konstanten Druck ermöglicht, wobei der erhöht angeordnete Kühlmittelbehälter über wenigstens einem Abschnitt des Kühlmittelkreislaufes erhöht angeordnet ist.
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公开(公告)号：GB2514263A
公开(公告)日：2014-11-19
申请号：GB201407784
申请日：2012-10-23
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , CHU RICHARD , SIMONS ROBERT , ELLSWORTH MICHAEL , CAMPBELL LEVI , MILNES DAVID PAUL
Abstract: A cooling unit (500) is provided to facilitate cooling of coolant passing through a coolant loop (501). The cooling unit (500) includes one or more heat rejection units (510a, 510b) and an elevated coolant tank (520). The heat rejection unit (510a, 510b) rejects heat from coolant passing through the coolant loop (501) to air passing across the heat rejection unit (510a, 510b). The heat rejection unit (510a, 510b) includes one or more heat exchange assemblies (600) coupled to the coolant loop (501) for at least a portion of the coolant to pass through the one or more heat exchange assemblies (600). The elevated coolant tank (520), which is elevated above at least a portion of the coolant loop (501), is coupled in fluid communication with the one or more heat exchange assemblies (600) of the heat rejection unit (510a, 510b), and facilitates return of coolant to the coolant loop (501) at a substantially constant pressure.
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公开(公告)号：CA2743110A1
公开(公告)日：2010-12-16
申请号：CA2743110
申请日：2010-05-11
Applicant: IBM
Inventor： SIMONS ROBERT , CAMPBELL LEVI , CHU RICHARD , IYENGAR MADHUSUDAN , ELLSWORTH MICHAEL JR
IPC: H05K7/20
Abstract: Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.
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Patent Agency Ranking
公开(公告)号：GB2496251A
公开(公告)日：2013-05-08
申请号：GB201216992
申请日：2012-09-24
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , SIMONS ROBERT
IPC: H05K7/20
Abstract: A multi-rack assembly is provided which includes adjacent first 901 and second 110 40 electronics cks, each being at least partially air-cooled, and an air-to-liquid heat exchanger 1800 associated with the first rack 901 for cooling at least a portion of air passing through the first rack 901; the heat exchanger 1800, which is disposed at the air inlet 902 or air outlet 903 side of the first rack 901 and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough; the assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop; and an airflow director 1710 associated with the second rack 110â40 and facitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger 1800 associated with the first rack 901. Also disclosed is a data centre containing said multi-rack assembly.
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公开(公告)号：CA2676092A1
公开(公告)日：2008-12-18
申请号：CA2676092
申请日：2008-05-09
Applicant: IBM
Inventor： SIMONS ROBERT , CAMPBELL LEVI , ELLSWORTH MICHAEL JR , CHU RICHARD , IYENGAR MADHUSUDAN
Abstract: A cooling system includes a facility cooling unit, a cooling tower, and o ne or more thermal capacitor units. The facility cooling unit, which include s a heat dissipation coolant loop, facilitates thermal energy extraction fro m a facility, such as a data center, for expelling of the energy to coolant within the heat dissipation coolant loop. The cooling tower is in fluid comm unication with the coolant loop, and includes a liquid-to-air heat exchanger for expelling thermal energy from coolant of the heat dissipation coolant l oop to the surrounding environment. The thermal capacitor unit is in fluid c ommunication with the heat dissipation coolant loop to facilitate efficient thermal energy transfer from coolant with in the coolant loop to the surroun ding environment with variation in ambient temperature about the cooling tow er.
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公开(公告)号：GB2500966B
公开(公告)日：2016-03-02
申请号：GB201301549
申请日：2013-01-29
Applicant: IBM
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公开(公告)号：AT408981T
公开(公告)日：2008-10-15
申请号：AT03811737
申请日：2003-10-10
Applicant: IBM
Inventor： CHU RICHARD , ELLSWORTH MICHAEL , FUREY EDWARD , SCHMIDT ROGER , SIMONS ROBERT
IPC: H05K7/20
Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.
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公开(公告)号：AT391406T
公开(公告)日：2008-04-15
申请号：AT05817223
申请日：2005-12-07
Applicant: IBM
Inventor： CAMPBELL LEVI , CHU RICHARD , ELLSWORTH MICHAEL , IYENGAR MADHUSUDAN , SCHMIDT ROGER , SIMONS ROBERT
IPC: H05K7/20 , F25D23/12 , H01L23/473
Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
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