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公开(公告)号:JPH09214627A
公开(公告)日:1997-08-15
申请号:JP31347196
申请日:1996-11-25
Applicant: IBM
Inventor: CINA MICHAEL FRANK , FLINT EPHRAIM BEMIS , GAUCHER BRIAN PAUL , KWARK YOUNG HOON , OPRYSKO MODEST MICHAEL , PENCE WILLIAM EDWARD , PONNAPALLI SAILA
IPC: H04M1/725 , H04M11/00 , H04W4/18 , H04W24/00 , H04W68/00 , H04W76/02 , H04W84/10 , H04W88/08 , H04Q7/38
Abstract: PROBLEM TO BE SOLVED: To provide a cordless modem including a pair of radio units interfacing to a standard data/fax modem in order that the user of a personal computer can connect to a telephone line by radio. SOLUTION: One of the pair of the radio units 32 and 34 is set to be a remote unit 32 interfacing to a modem housed in a PC(personal computer) and the other is set to be a base station unit 34 connected to a standard wall telephone jack. By this solving way, a user obtains the convenience and freedom of using the PC, a lap top, a personal digital assistant(PDA), etc., within the range of 100 to 200m from the telephone jack without the interference of a code. When a signal intensity between one pair of the radio units 32 and 34 is not more than a prescribed threshold value, an alarm on the remote unit informs the user of it.
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公开(公告)号:DE3780346D1
公开(公告)日:1992-08-20
申请号:DE3780346
申请日:1987-04-14
Applicant: IBM
Inventor: FLINT EPHRAIM BEMIS , GREBE KURT RUDOLPH
IPC: F28F9/22 , H01L23/433 , H01L23/473
Abstract: A manifold (30) for conducting coolant to a set of heat exchangers (26) mounted on individual electric circuit chips (22) of a circuit module (20) is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages (44) connected to the apertures for conducting coolant to ports of the heat exchangers. The body (40) is formed of two sections, one section (54) having channels machined therein to serve as the fluid passages, and a second (56) section having the apertures. The second section also is bounded by sidewalls which define a cavity (60). The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.
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公开(公告)号:MY120688A
公开(公告)日:2005-11-30
申请号:MYPI9700117
申请日:1997-01-10
Applicant: IBM
Inventor: CINA MICHAEL FRANK , FLINT EPHRAIM BEMIS , GAUCHER BRIAN PAUL , KWARK YOUNG HOON , OPRYSKO MODEST MICHAEL , PENCE WILLIAM EDWARD , PONNAPALLI SAILA
Abstract: A CORDLESS MODEM COMPRISES A RADIO PAIR INTERFACED TO A STANDARD DATA/FAX MODEM (36) WHICH ALLOWS A USER OF A PERSONAL COMPUTER (30) TO WIRELESSLY CONNECT TO A TELEPHONE LINE. ONE END OF THE RADIO PAIR IS A REMOTE UNIT (32) INTERFACED TO THE MODEM CONTAINED WITHIN THE PC WHILE THE OTHER END IS A BASE UNIT (34) CONNECTED TO A STANDARD TELEPHONE WALL JACK (40, 90). 'THIS ARRANGEMENT ALLOWS THE USER THE CONVENIENCE AND FREEDOM OF USING A PC, LAPTOP, PERSONAL DIGITAL ASSISTANT, ETC., WITHIN SEVERAL HUNDRED FEET OF A PHONE JACK WITHOUT BEING ENCUMBERED BY A CORD. A WARNING ALARM (61) ON THE REMOTE UNIT INFORMS THE USER WHEN THE SIGNAL STRENGTH BETWEEN THE RADIO PAIR IS BELOW A THRESHOLD VALUE. ADDITIONALLY, THE BASE UNIT MAY BE EQUIPPED WITH TWO SPATIALLY SEPARATED ANTENNAS (70, 70') TO HELP MITIGATE THE EFFECTS OF SIGNAL FADING.
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公开(公告)号:DE69207460D1
公开(公告)日:1996-02-22
申请号:DE69207460
申请日:1992-03-06
Applicant: IBM
Inventor: FLINT EPHRAIM BEMIS , YARMCHUK EDWARD JOHN
Abstract: A method and structure permit the precision alignment in the packaging of optical components (10), such as lasers, detectors, lenses and waveguides. The technique involves capacitance measurements of an array of plates placed on the optoelectronic device chip and its package substrate (12). The technique uses phase sensitive detection to sense the total current capacitively coupled into a passive plate (14) on the device chip (10) from two overlapping plates (16, 18) located on the package substrate. When the device chip (10) is properly aligned with respect to the package substrate (12), the summed current sensed with a third overlapping plate (22) on the package substrate is a null.
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