2.
    发明专利
    未知

    公开(公告)号:DE3780346D1

    公开(公告)日:1992-08-20

    申请号:DE3780346

    申请日:1987-04-14

    Applicant: IBM

    Abstract: A manifold (30) for conducting coolant to a set of heat exchangers (26) mounted on individual electric circuit chips (22) of a circuit module (20) is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages (44) connected to the apertures for conducting coolant to ports of the heat exchangers. The body (40) is formed of two sections, one section (54) having channels machined therein to serve as the fluid passages, and a second (56) section having the apertures. The second section also is bounded by sidewalls which define a cavity (60). The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

    4.
    发明专利
    未知

    公开(公告)号:DE69207460D1

    公开(公告)日:1996-02-22

    申请号:DE69207460

    申请日:1992-03-06

    Applicant: IBM

    Abstract: A method and structure permit the precision alignment in the packaging of optical components (10), such as lasers, detectors, lenses and waveguides. The technique involves capacitance measurements of an array of plates placed on the optoelectronic device chip and its package substrate (12). The technique uses phase sensitive detection to sense the total current capacitively coupled into a passive plate (14) on the device chip (10) from two overlapping plates (16, 18) located on the package substrate. When the device chip (10) is properly aligned with respect to the package substrate (12), the summed current sensed with a third overlapping plate (22) on the package substrate is a null.

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