公开(公告)号：DE1247113B

公开(公告)日：1967-08-10

申请号：DEJ0029497

申请日：1965-12-02

Applicant: IBM

Inventor： GREBE KURT RUDOLPH ,  POWERS JOHN VINCENT

IPC: C25D3/46

公开(公告)号：DE1186509B

公开(公告)日：1965-02-04

申请号：DEJ0023925

申请日：1963-06-22

Applicant: IBM

Inventor： ELFANT ROBERT FREDERICK ,  GREBE KURT RUDOLPH

IPC: G11C7/02 ,  G11C11/06

Abstract: 1,023,627. Magnetic storage devices. INTERNATIONAL BUSINESS MACHINES CORPORATION. Oct. 26, 1964 [Nov. 21, 1963], No. 43506/64. Addition to 998,891. Heading H3B. [Also in Division H1] The tubular storage device described in the parent Specification is modified by the use of hole pairs for the conductors B in the form of two parallel slits 18 arranged longitudinally of the tube 12, each conductor B being made of strip material. The tube is formed by a magnetic U-shaped trough 14 and a magnetic closure plate 16, the same or different materials being used. The magnetization characteristic of the magnetic material need not be rectangular.

公开(公告)号：DE3265496D1

公开(公告)日：1985-09-26

申请号：DE3265496

申请日：1982-02-02

Applicant: IBM

Inventor： GREBE KURT RUDOLPH ,  HARPER JAMES MCKELL EDWIN

IPC: H05K3/34 ,  B23K1/005 ,  B23K1/20 ,  B23K17/00 ,  C23G5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60

Abstract: A method of fluxlessly joining members e.g. solder pads, having relatively low melting materials is described. The members to be joined are exposed in a non-oxydising atmosphere to ion beam radiation of sufficient intensify and for a time sufficiently long to cause cleaning of the low melting materials by removal of contaminating surface oxide layers. The members are then placed into juxtaposition with each other and are heated for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members. The members may be heated conventionally or may be exposed again to an ion beam radiation to effect joining. In a second example, contacting members are cleaned and reflowed in a single step by exposure to an ion beam radiation. In the Figure an ion beam 28 impinges on solder pads 32 on a chip 30 and on matching solder pads 38 on a substrate 36. After cleaning the pads the chip 30 is flipped on to the substrate 36, (indicated by the arrow), and further heated, e.g. by further radiation, to effect joining by solder reflow.

公开(公告)号：DE1202332B

公开(公告)日：1965-10-07

申请号：DEJ0023939

申请日：1963-06-25

Applicant: IBM

Inventor： BARTKUS EDWARD ALFRED ,  ELFANT ROBERT FREDERICK ,  GREBE KURT RUDOLPH ,  MAZZEO NICHOLAS JOSEPH

IPC: G11C7/02 ,  G11C11/06

Abstract: 1,023,627. Magnetic storage devices. INTERNATIONAL BUSINESS MACHINES CORPORATION. Oct. 26, 1964 [Nov. 21, 1963], No. 43506/64. Addition to 998,891. Heading H3B. [Also in Division H1] The tubular storage device described in the parent Specification is modified by the use of hole pairs for the conductors B in the form of two parallel slits 18 arranged longitudinally of the tube 12, each conductor B being made of strip material. The tube is formed by a magnetic U-shaped trough 14 and a magnetic closure plate 16, the same or different materials being used. The magnetization characteristic of the magnetic material need not be rectangular.

公开(公告)号：BR8906690A

公开(公告)日：1990-09-11

申请号：BR8906690

申请日：1989-12-22

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN LESLIE ,  DONSON WILLIAM ARTHUR ,  GLENNING JOHN JOSEPH ,  GOLDBERG MARTIN JOSEPH ,  GREBE KURT RUDOLPH ,  KOVAC CAROLINE ANN ,  MATTHEW LINDA CROLYN ,  PAWLOWSKI WALTER PAUL ,  SCHADT MARK JEFREY ,  SCHEUERMANN MICHAEL ROY ,  TISDALE STEPHEN LEO

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  C08F8/42 ,  C08J7/06

公开(公告)号：DE2424338A1

公开(公告)日：1975-02-13

申请号：DE2424338

申请日：1974-05-18

Applicant: IBM

Inventor： GREBE KURT RUDOLPH

IPC: H05K3/46 ,  C23F1/00 ,  G03F1/08 ,  G03F7/095 ,  H01L21/00 ,  H01L21/306 ,  H01L49/02 ,  H05K3/04 ,  H05K3/14 ,  H01B5/14

Abstract: A method and structure for use in depositing thin films which avoids edge-tearing of the films. The structure is a composite comprising a photosensitive layer (photoresist) on the substrate onto which deposition is to occur, and an overlaying masking layer (which is conveniently a metal such as aluminum). Apertures in the photoresist layer and the masking layer expose portions of the substrate. The masking layer acts as a deposition mask which is spaced away from the substrate at a distance equal to the thickness of the underlying photoresist layer. The photoresist layer acts to keep the masking layer in close proximity to the substrate and is patterned through the use of the overlying masking layer as an exposure mask. Recession of the edges of the photoresist layer is achieved by overexposure and subsequent development. In this manner, the masking layer overhangs the photoresist layer, thereby providing an undercut in order to prevent edge-tearing of deposited films.

公开(公告)号：DE3780346D1

公开(公告)日：1992-08-20

申请号：DE3780346

申请日：1987-04-14

Applicant: IBM

Inventor： FLINT EPHRAIM BEMIS ,  GREBE KURT RUDOLPH

IPC: F28F9/22 ,  H01L23/433 ,  H01L23/473

Abstract: A manifold (30) for conducting coolant to a set of heat exchangers (26) mounted on individual electric circuit chips (22) of a circuit module (20) is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages (44) connected to the apertures for conducting coolant to ports of the heat exchangers. The body (40) is formed of two sections, one section (54) having channels machined therein to serve as the fluid passages, and a second (56) section having the apertures. The second section also is bounded by sidewalls which define a cavity (60). The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

公开(公告)号：DE3068906D1

公开(公告)日：1984-09-13

申请号：DE3068906

申请日：1980-11-20

Applicant: IBM

Inventor： AMES IRVING ,  ANACKER WILHELM ,  GREBE KURT RUDOLPH ,  KIRCHER CHARLES JOHN

IPC: H01L27/18 ,  H01L23/485 ,  H01L23/532 ,  H01L39/02 ,  H01L39/22

Abstract: Circuit connection for electrical circuitry, and particularly superconducting circuits including Josephson tunnelling devices, wherein solder lands can be used to make electrical connection to electric lines without interdiffusion between the lines and the solder. … To avoid the interdiffusion problem, a laterally extending metallic layer (18) is used as a diffusion barrier between the solder land (28) and the electrical line (M) which can be a superconducting line. The diffusion layer is comprised of refractory metal and has a first portion electrically contacting the solder land and a second, laterally displaced portion, electrically contacting the electrical line. An insulating layer (22) on the diffusion barrier layer separates the solder land and the electrical line. In a specific embodiment, the diffusion barrier is comprised of niobium, and the solder is a low melting point alloy, typically comprised of indium, bismuth, and tin.