公开(公告)号：EP2008216A4

公开(公告)日：2009-12-23

申请号：EP07870421

申请日：2007-01-23

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H03H5/00 ,  H01P3/00 ,  H01P3/02 ,  H01P5/10

CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/026

公开(公告)号：WO2007089341A3

公开(公告)日：2008-04-17

申请号：PCT/US2006048020

申请日：2006-12-18

Applicant: IBM ,  GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L23/48

CPC classification number: H01Q9/16 ,  H01L23/49555 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.

Abstract translation: 提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。 一方面，一种电子设备（20）包括IC芯片（22）和天线系统（23），其中IC芯片（22）和天线系统（23）一体地封装在一起，包括在引线芯片级封装 21），并且其中天线系统（23）包括具有由封装引线形成的辐射元件的天线。

公开(公告)号：WO2008062311A3

公开(公告)日：2009-04-23

申请号：PCT/IB2007004244

申请日：2007-01-23

Applicant: IBM ,  GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H03H5/00

CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/026

Abstract: Waveguide-to-transmission line transitions are provided for broadband, high performance coupling of power at microwave and millimeter wave frequencies. In one aspect, a transition apparatus (10) includes a transition housing (11) comprising a rectangular waveguide channel (C) and an aperture (13) formed through a broad wall (11a) of the rectangular waveguide channel (C), a substrate ( 12) having a first surface and a second surface opposite the first surface, mid a planar transmission line (12a) and a planar probe (12b) formed on the first surface, wherein the planar transmission line (12a) comprises a first conductive strip and a second conductive strip, wherein the planar probe (12b) is connected to, and extends from, an end of the first conductive strip, and wherein an end of the second conductive strip is terminated by a stub and wherein the substrate (22) is positioned in the aperture (13) such that the printed probe (12b) protrudes into the rectangular waveguide channel (C) at an offset from a center of the broad wall (11a) and wherein the ends of the first and second conductive strip are aligned to an inner surface of the broad wail (11a) of the rectangular waveguide channel (C).

Abstract translation: 提供波导到传输线路转换用于宽带，高性能的微波和毫米波频率耦合。 一方面，一种过渡装置（10）包括：过渡壳体（11），包括矩形波导通道（C）和通过矩形波导通道（C）的宽壁（11a）形成的孔（13），基底 （12）具有第一表面和与第一表面相对的第二表面，在平面传输线（12a）的中间和形成在第一表面上的平面探针（12b），其中平面传输线（12a）包括第一导电条 和第二导电条，其中所述平面探针（12b）连接到所述第一导电条的端部并从所述第一导电条的端部延伸，并且其中所述第二导电条的端部由短截线终止，并且其中所述基底（22） 被定位在所述孔（13）中，使得所述印刷探针（12b）从所述宽壁（11a）的中心偏移地突出到所述矩形波导通道（C）中，并且其中所述第一和第二导电条的端部 与广泛的内表面对齐 矩形波导通道（C）的壁（11a）。

公开(公告)号：WO03007418A8

公开(公告)日：2004-12-16

申请号：PCT/US0216646

申请日：2002-05-29

Applicant: IBM ,  FLINT EPHRAIM B ,  GAUCHER BRIAN P ,  LIU DUIXIAN

Inventor： FLINT EPHRAIM B ,  GAUCHER BRIAN P ,  LIU DUIXIAN

IPC: H01Q21/29 ,  G06F1/16 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/44 ,  H01Q5/00 ,  H01Q5/01 ,  H01Q9/04 ,  H01Q13/08

CPC classification number: H01Q1/2275 ,  H01Q1/22 ,  H01Q1/2266 ,  H01Q1/44 ,  H01Q5/378 ,  H01Q9/0421 ,  H01Q9/42

Abstract: The present invention relates to an antenna for integration into a portable processing device. The antenna includes an electronic display metal support frame (303) for grounding a conducting element, a pair of radiating elements (301, 302) extending from the display frame (303), and a means for conducting a dual-band signal comprising a first component for carrying a signal connected to the first and second radiating elements (301, 302) and a second component for grounding the conducting means connected to the display frame (303).

Abstract translation: 本发明涉及用于集成到便携式处理装置中的天线。 天线包括用于使导电元件接地的电子显示金属支撑框架（303），从显示框架（303）延伸的一对辐射元件（301,302），以及用于进行双频带信号的装置，包括第一 用于承载连接到第一和第二辐射元件（301,302）的信号的部件和用于使连接到显示框架（303）的导电装置接地的第二部件。

公开(公告)号：JP2008042904A

公开(公告)日：2008-02-21

申请号：JP2007195973

申请日：2007-07-27

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： NILS DENEKE HOIVIK ,  JOHN MICHAEL COTT ,  KNICKERBOCKER JOHN U ,  GAUCHER BRIAN P ,  JANUSZ GRZYB ,  CHRISTOPHER VINCENT JAHNES ,  JOHN HAROLD MAGERLEIN ,  CHIRAG SURYAKANT PATEL ,  DUIXIAN LIU ,  PFEIFFER ULLRICH R ,  TSANG CORNELIA KANG-I

IPC: H01Q19/06 ,  H01L23/12 ,  H01L23/14 ,  H01L25/00 ,  H01Q19/10 ,  H01Q19/12

CPC classification number: H01L25/165 ,  H01L23/66 ,  H01L24/24 ,  H01L24/82 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide a Si-based packaging with integrated passive components for millimeter wave applications. SOLUTION: An apparatus is described incorporating an interposer 1 having a cavity for a portion of an antenna structure 22, having conductor through vias 3, a top Si part 6 having interconnection wiring 72, 73, 74 and having pads for electrically mounting an integrated circuit chip 21 thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and the top Si part may be scaled to provide an array of functional units. This invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供用于毫米波应用的集成无源组件的Si基封装。 解决方案：描述一种装置，其包括具有用于天线结构22的一部分的腔的插入器1，其具有导体穿过通孔3，顶部Si部分6具有互连布线72,73,74并具有用于电安装的垫 其上的集成电路芯片21，其中顶部Si部件电气和机械地与插入器配合。 插入器和顶部Si部分可以被缩放以提供功能单元的阵列。 本发明克服了将高效率天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2002084117A

公开(公告)日：2002-03-22

申请号：JP2001188413

申请日：2001-06-21

Applicant: IBM

Inventor： ASANO TAKESHI ,  FLINT EPHRAIM B ,  FUJII KAZUO ,  GAUCHER BRIAN P ,  LIU DUIXIAN ,  OIE MASAKI ,  STUDWELL THOMAS W ,  USUI HIDEYUKI

IPC: G06F1/16 ,  G09F9/00 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q21/28 ,  H01Q21/29

Abstract: PROBLEM TO BE SOLVED: To provide a display, a computer terminal and an antenna which enables an antenna to be installed without enlarging its frame or downsizing a display panel, and can receive radio waves sufficiently well, if the frame is made of a conductive material. SOLUTION: A notebook type computer terminal has a thin sheet-like slot antenna 20, installed in a gap between a display panel 13 and a sidewall 16 of a display panel frame 14, with its a transmitter-receiver 20a being projected over a prescribed length from a conductive material-made casing 13A of the display panel 13 and a stay 21. The antenna 20 has a ground part 20b connected to the ground of a radio wave-signal converter circuit and also to the conductive material-made frame 14 via the stay 21.

公开(公告)号：JP2005176366A

公开(公告)日：2005-06-30

申请号：JP2004353546

申请日：2004-12-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  RUDOLF PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L21/822 ,  H01L27/04 ,  H01P11/00 ,  H01Q1/00 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q9/28 ,  H01Q9/30 ,  H01Q9/40 ,  H01Q13/08 ,  H01Q23/00

CPC classification number: H01Q9/0407 ,  H01L23/66 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/73207 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/28 ,  H01Q9/40 ,  H01Q23/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an antenna which is constituted by using one or a plurality of conductive via stubs formed as radiating elements in a substrate. SOLUTION: A method which constitutes the antenna contains a step for preparing the substrate having a first and a second surfaces which are almost parallel to each other, and a step wherein via holes are formed between the first and the second surfaces penetrating the substrate and filled with a conductive material, the conductive via stubs are formed and the radiating elements are formed in the substrate. The antenna and an IC chip (e.g. a transceiver of an IC type, a receiver, a transmitter, etc.) are collectively packaged, and an integrally formed communication system for radio or RF (high frequency) can be formed. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种天线，其通过使用在基板中形成为辐射元件的一个或多个导电通孔短路而构成。 解决方案：构成天线的方法包括用于制备具有彼此大致平行的第一和第二表面的基板的步骤，以及在穿过第一和第二表面之间形成通孔的步骤 衬底并且填充有导电材料，形成导电通路短截线，并且辐射元件形成在衬底中。 天线和IC芯片（例如，IC型收发器，接收器，发射器等）被集体封装，并且可以形成用于无线电或RF（高频）的整体形成的通信系统。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：CA2637038A1

公开(公告)日：2007-08-09

申请号：CA2637038

申请日：2006-12-18

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  ZWICK THOMAS M ,  PFEIFFER ULLRICH R

IPC: H01L23/48

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

公开(公告)号：CA2637038C

公开(公告)日：2014-09-09

申请号：CA2637038

申请日：2006-12-18

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L23/48

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.

公开(公告)号：AU2002310145A1

公开(公告)日：2003-01-29

申请号：AU2002310145

申请日：2002-05-29

Applicant: IBM

Inventor： FLINT EPHRAIM B ,  LIU DUIXIAN ,  GAUCHER BRIAN P

IPC: H01Q21/29 ,  G06F1/16 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/44 ,  H01Q5/00 ,  H01Q5/10 ,  H01Q5/378 ,  H01Q9/04 ,  H01Q13/08

Abstract: Dual-band antennas that are embedded within portable devices such as laptop computers. In one aspect, a dual-band antenna for a portable device (e.g., laptop computer) includes a first element having a resonant frequency in a first frequency band and a second element having a resonant frequency in a second frequency band, wherein the first element is connected to a signal feed, wherein the second element is grounded, and wherein the first and second elements are integrated within a portable device.