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    APPARATUS AND METHODS FOR CONSTRUCTING AND PACKAGING WAVEGUIDE TO PLANAR TRANSMISSION LINE TRANSITIONS FOR MILLIMETER WAVE APPLICATIONS
    5.
    发明申请
    APPARATUS AND METHODS FOR CONSTRUCTING AND PACKAGING WAVEGUIDE TO PLANAR TRANSMISSION LINE TRANSITIONS FOR MILLIMETER WAVE APPLICATIONS 审中-公开
    用于构造和包装波形到用于微波波形应用的平面传输线转换的装置和方法

    公开(公告)号：WO2008062311A3

    公开(公告)日：2009-04-23

    申请号：PCT/IB2007004244

    申请日：2007-01-23

    Applicant: IBM ,  GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

    Inventor： GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

    IPC: H03H5/00

    CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/026

    Abstract: Waveguide-to-transmission line transitions are provided for broadband, high performance coupling of power at microwave and millimeter wave frequencies. In one aspect, a transition apparatus (10) includes a transition housing (11) comprising a rectangular waveguide channel (C) and an aperture (13) formed through a broad wall (11a) of the rectangular waveguide channel (C), a substrate ( 12) having a first surface and a second surface opposite the first surface, mid a planar transmission line (12a) and a planar probe (12b) formed on the first surface, wherein the planar transmission line (12a) comprises a first conductive strip and a second conductive strip, wherein the planar probe (12b) is connected to, and extends from, an end of the first conductive strip, and wherein an end of the second conductive strip is terminated by a stub and wherein the substrate (22) is positioned in the aperture (13) such that the printed probe (12b) protrudes into the rectangular waveguide channel (C) at an offset from a center of the broad wall (11a) and wherein the ends of the first and second conductive strip are aligned to an inner surface of the broad wail (11a) of the rectangular waveguide channel (C).

    Abstract translation: 提供波导到传输线路转换用于宽带，高性能的微波和毫米波频率耦合。 一方面，一种过渡装置（10）包括：过渡壳体（11），包括矩形波导通道（C）和通过矩形波导通道（C）的宽壁（11a）形成的孔（13），基底 （12）具有第一表面和与第一表面相对的第二表面，在平面传输线（12a）的中间和形成在第一表面上的平面探针（12b），其中平面传输线（12a）包括第一导电条 和第二导电条，其中所述平面探针（12b）连接到所述第一导电条的端部并从所述第一导电条的端部延伸，并且其中所述第二导电条的端部由短截线终止，并且其中所述基底（22） 被定位在所述孔（13）中，使得所述印刷探针（12b）从所述宽壁（11a）的中心偏移地突出到所述矩形波导通道（C）中，并且其中所述第一和第二导电条的端部 与广泛的内表面对齐 矩形波导通道（C）的壁（11a）。

    PACKAGING ANTENNAS WITH INTEGRATED CIRCUIT CHIPS
    6.
    发明申请
    PACKAGING ANTENNAS WITH INTEGRATED CIRCUIT CHIPS 审中-公开
    包装天线与集成电路

    公开(公告)号：WO2006133108A3

    公开(公告)日：2007-11-29

    申请号：PCT/US2006021770

    申请日：2006-06-05

    Applicant: IBM ,  CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

    Inventor： CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

    IPC: H04B1/28

    CPC classification number: H01Q1/22 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01L2924/00

    Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).

    Abstract translation: 提供了用于整体封装由封装框架结构（例如，引线框架，封装载体，封装芯等）整体构建的半导体IC（集成电路）芯片和天线装置的集成封装，从而形成紧凑的集成无线电/无线 通信系统用于毫米波应用。 例如，电子设备（30）包括具有整体形成为封装框架（11）的一部分的天线（12）的封装框架（11），安装在封装框架（11）上的IC（集成电路）芯片 框架（11），提供到IC芯片（13）和天线（12）的电连接的互连（19）和封装盖（15）。

    APPARATUS AND METHODS FOR PACKAGING INTEGRATED CIRGUIT CHIPS WITH ANTENNAS FORMED FROM PACKAGE LEAD WIRES
    8.
    发明专利
    APPARATUS AND METHODS FOR PACKAGING INTEGRATED CIRGUIT CHIPS WITH ANTENNAS FORMED FROM PACKAGE LEAD WIRES 未知

    公开(公告)号：CA2637038C

    公开(公告)日：2014-09-09

    申请号：CA2637038

    申请日：2006-12-18

    Applicant: IBM

    Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

    IPC: H01L23/48

    Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.

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