公开(公告)号：EP1866937A4

公开(公告)日：2010-09-29

申请号：EP06734927

申请日：2006-02-10

Applicant: IBM

Inventor： GOREN DAVID ,  PFEIFFER ULLRICH R ,  SHEINMAN BENNY ,  SHLAFMAN SHLOMO

IPC: H01F5/00 ,  H01F27/28 ,  H01L21/20 ,  H01L29/00

CPC classification number: H01L23/5223 ,  H01L23/5225 ,  H01L23/5286 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03F3/26 ,  H03F3/45089 ,  H03F3/602 ,  H01L2924/00

公开(公告)号：EP1886412A4

公开(公告)日：2009-07-08

申请号：EP06760686

申请日：2006-06-05

Applicant: IBM

Inventor： CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H04B1/28 ,  H01Q1/22

CPC classification number: H01Q1/22 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01L2924/00

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).

公开(公告)号：EP1882305A4

公开(公告)日：2010-07-21

申请号：EP06734926

申请日：2006-02-10

Applicant: IBM

Inventor： FLOYD BRIAN A ,  GARCIA ALBERTO VALDES ,  PFEIFFER ULLRICH R ,  REYNOLDS SCOTT KEVIN

IPC: H03F3/217 ,  H03F3/04

CPC classification number: H03F3/2176 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/411 ,  H03F2200/451 ,  H03F2200/75

公开(公告)号：EP2008216A4

公开(公告)日：2009-12-23

申请号：EP07870421

申请日：2007-01-23

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  GRYZB JANUSZ ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H03H5/00 ,  H01P3/00 ,  H01P3/02 ,  H01P5/10

CPC classification number: H01P5/107 ,  H01P3/003 ,  H01P3/026

公开(公告)号：JP2006191027A

公开(公告)日：2006-07-20

申请号：JP2005363798

申请日：2005-12-16

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： FLOYD BRIAN A ,  PFEIFFER ULLRICH R ,  REYNOLDS SCOTT K

IPC: H01L21/822 ,  H01L23/12 ,  H01L27/04

CPC classification number: H05K1/111 ,  H01L23/5225 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19051 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P5/02 ,  H05K1/0237 ,  H05K2201/0723 ,  H05K2201/0792 ,  H05K2201/09781 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide an on-chip circuit pad used on a lossy substrate to improve substrate induced losses. SOLUTION: A shielded circuit pad is provided where parasitic capacitance is controlled by the inclusion of a shunt transmission line stub which reduces the substrate induced loss in millimeter-wave application. The circuit pad is located on the substrate with a shield located beneath the circuit pad, and the shunt transmission line stub attached to the circuit pad. Accordingly, controlled impedance is obtained for the millimeter-wave application. The space between the circuit pad and the shield may then be minimized. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供在有损基板上使用的片上电路板，以改善基板感应损耗。 解决方案：提供屏蔽电路板，其中通过包括分流传输线短截线来控制寄生电容，其减少了基于毫米波应用的衬底感应损耗。 电路板位于基板上，屏蔽层位于电路板下方，并且分流传输线插脚连接到电路板。 因此，对于毫米波应用获得受控阻抗。 然后可以最小化电路板和屏蔽之间的空间。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2008042904A

公开(公告)日：2008-02-21

申请号：JP2007195973

申请日：2007-07-27

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： NILS DENEKE HOIVIK ,  JOHN MICHAEL COTT ,  KNICKERBOCKER JOHN U ,  GAUCHER BRIAN P ,  JANUSZ GRZYB ,  CHRISTOPHER VINCENT JAHNES ,  JOHN HAROLD MAGERLEIN ,  CHIRAG SURYAKANT PATEL ,  DUIXIAN LIU ,  PFEIFFER ULLRICH R ,  TSANG CORNELIA KANG-I

IPC: H01Q19/06 ,  H01L23/12 ,  H01L23/14 ,  H01L25/00 ,  H01Q19/10 ,  H01Q19/12

CPC classification number: H01L25/165 ,  H01L23/66 ,  H01L24/24 ,  H01L24/82 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide a Si-based packaging with integrated passive components for millimeter wave applications. SOLUTION: An apparatus is described incorporating an interposer 1 having a cavity for a portion of an antenna structure 22, having conductor through vias 3, a top Si part 6 having interconnection wiring 72, 73, 74 and having pads for electrically mounting an integrated circuit chip 21 thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and the top Si part may be scaled to provide an array of functional units. This invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供用于毫米波应用的集成无源组件的Si基封装。 解决方案：描述一种装置，其包括具有用于天线结构22的一部分的腔的插入器1，其具有导体穿过通孔3，顶部Si部分6具有互连布线72,73,74并具有用于电安装的垫 其上的集成电路芯片21，其中顶部Si部件电气和机械地与插入器配合。 插入器和顶部Si部分可以被缩放以提供功能单元的阵列。 本发明克服了将高效率天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：WO2006110207A2

公开(公告)日：2006-10-19

申请号：PCT/US2006005013

申请日：2006-02-10

Applicant: IBM ,  GOREN DAVID ,  PFEIFFER ULLRICH R ,  SHEINMAN BENNY ,  SHLAFMAN SHLOMO

Inventor： GOREN DAVID ,  PFEIFFER ULLRICH R ,  SHEINMAN BENNY ,  SHLAFMAN SHLOMO

IPC: H01L29/00

CPC classification number: H01L23/5223 ,  H01L23/5225 ,  H01L23/5286 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03F3/26 ,  H03F3/45089 ,  H03F3/602 ,  H01L2924/00

Abstract: Methods are provided for building integrated circuit transformer devices having compact universal and scalable architectures for millimeter wave applications. For example, an integrated circuit transformer (22) is formed on a semiconductor substrate (21) and includes a ground shield (23) formed on the substrate (21), a primary conductor (24) comprising an elongated conductive strip and a secondary conductor (25) comprising an elongated conductive strip. The primary conductor (24) and the secondary conductor (25) are aligned to form a coupled-wire structure that is disposed adjacent to the ground shield (23). The ground shield (23) comprises a pattern of close-ended parallel elongated slots (23a) and parallel conductive strips (23b) that are commonly connected at end portions thereof along edge regions (23c) of the ground shield (23). The slots (23a) and strips (23b) are disposed orthogonal to the primary (24) and secondary (25) conductors. The edge regions (23c) provide current return paths that are collinear to the primary (24) and secondary (25) conductors. The integrated circuit transformer (22) can be used as template or building block, which is parameterized by length, for constructing various integrated circuit devices and modular structures including, but not limited to, power amplifiers, n:l impendence transformers, and power combiners.

Abstract translation: 提供了用于构建具有用于毫米波应用的紧凑通用和可扩展架构的集成电路变压器设备的方法。 例如，集成电路变压器（22）形成在半导体衬底（21）上并且包括形成在衬底（21）上的接地屏蔽（23），包括细长导电条和次级导体 （25）包括细长导电条。 主导体（24）和次级导体（25）被对准以形成邻近接地屏蔽（23）设置的耦合线结构。 接地屏蔽（23）包括在接地屏蔽（23）的边缘区域（23c）处在其端部共同连接的近端平行细长槽（23a）和平行导电条（23b）的图案。 槽（23a）和条（23b）与主（24）和次（25）导体正交设置。 边缘区域（23c）提供与初级（24）和次级（25）导体共线的电流返回路径。 集成电路变压器（22）可以用作模板或构件块，其长度参数化，用于构建各种集成电路装置和模块化结构，包括但不限于功率放大器，n阻抗变压器和功率组合器 。

公开(公告)号：WO2007089341A3

公开(公告)日：2008-04-17

申请号：PCT/US2006048020

申请日：2006-12-18

Applicant: IBM ,  GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L23/48

CPC classification number: H01Q9/16 ,  H01L23/49555 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.

Abstract translation: 提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。 一方面，一种电子设备（20）包括IC芯片（22）和天线系统（23），其中IC芯片（22）和天线系统（23）一体地封装在一起，包括在引线芯片级封装 21），并且其中天线系统（23）包括具有由封装引线形成的辐射元件的天线。

公开(公告)号：CA2637038A1

公开(公告)日：2007-08-09

申请号：CA2637038

申请日：2006-12-18

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  ZWICK THOMAS M ,  PFEIFFER ULLRICH R

IPC: H01L23/48

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

公开(公告)号：CA2637038C

公开(公告)日：2014-09-09

申请号：CA2637038

申请日：2006-12-18

Applicant: IBM

Inventor： GAUCHER BRIAN P ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H01L23/48

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.