公开(公告)号：EP1587764A4

公开(公告)日：2009-04-15

申请号：EP03790042

申请日：2003-11-25

Applicant: IBM

Inventor： GOVINDARAJAN NATARAJAN ,  AHMAD UMAR ,  BEZAMA RASHID J ,  HUMENIK JAMES N ,  KNICKERBOCKER JOHN U ,  VALLABHANENI RAO V

IPC: B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

CPC classification number: B32B18/00 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01L3/502707 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C1/00119 ,  C04B35/645 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/704

Abstract: A plate (10) for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures (22) (24) in a set of greensheets are formed by a material removal process, at least some of the apertures (25) being filled with a fugitive material (222) that escapes during sintering.

公开(公告)号：JP2000236038A

公开(公告)日：2000-08-29

申请号：JP2000025917

申请日：2000-02-03

Applicant: IBM

Inventor： GOVINDARAJAN NATARAJAN

IPC: H01L23/12 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To offer a structure and a method which enable usage of at least one very thin green tape with an assistance of at least one thick green tape. SOLUTION: This method for forming a lamination structure uses at least one organic bonding barrier 33 to bond at least one very thin green sheet 10 and/or at least one green sheet having high-density conductive patterns 26 and 28 to at least one thick green sheet 20. This enables the high-density multilayer ceramic structure to be intactly peeled from the lamination plate, and to be obtained as a product.

公开(公告)号：JPH11323554A

公开(公告)日：1999-11-26

申请号：JP7813199

申请日：1999-03-23

Applicant: IBM

Inventor： DONALD RENE WALL ,  GOVINDARAJAN NATARAJAN ,  REDDY SRINIVASA S-N

IPC: C23C16/08 ,  H01L21/285

Abstract: PROBLEM TO BE SOLVED: To provide a device for depositing a source metal on the surface of an accepting metal bonded to a ceramic substrate. SOLUTION: A CVD process in indicated. In this process, a source metal 21 such as nickel or a nickel metal is deposited on to the surface of an accepting metal 12 by using an iodine source 27. The soruce metal and an inert material 23 giving separation to the space between the source metal and the surface of the accepting metal is integrated to a single structure 20. Fundamentally, the CVD of Ni on Mo or W is made possible. The nickel source is physically separated from the surface of a high m.p. metal to be applied with plating by using at least one kind of inert material. The inert material is in floating contact with the surface of the high m.p. metal to be coated with nickel or a nickel alloy.

公开(公告)号：AU2003293051A1

公开(公告)日：2004-08-10

申请号：AU2003293051

申请日：2003-11-25

Applicant: IBM

Inventor： HUMENIK JAMES N ,  KNICKERBOCKER JOHN U ,  VALLABHANENI RAO V ,  GOVINDARAJAN NATARAJAN ,  AHMAD UMAR ,  BEZAMA RASHID J

IPC: B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.