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Patent Agency Ranking
公开(公告)号：EP1587764A4
公开(公告)日：2009-04-15
申请号：EP03790042
申请日：2003-11-25
Applicant: IBM
Inventor： GOVINDARAJAN NATARAJAN , AHMAD UMAR , BEZAMA RASHID J , HUMENIK JAMES N , KNICKERBOCKER JOHN U , VALLABHANENI RAO V
CPC classification number: B32B18/00 , B01J2219/00286 , B01J2219/00317 , B01L3/502707 , B01L3/5085 , B01L2200/12 , B01L2300/0816 , B01L2300/0819 , B01L2300/0887 , B01L2300/12 , B81B2203/0338 , B81B2203/0353 , B81C1/00119 , C04B35/645 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/704
Abstract: A plate (10) for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures (22) (24) in a set of greensheets are formed by a material removal process, at least some of the apertures (25) being filled with a fugitive material (222) that escapes during sintering.
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公开(公告)号：JPH0925167A
公开(公告)日：1997-01-28
申请号：JP33144795
申请日：1995-12-20
Applicant: IBM , CARBORUNDUM CO
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公开(公告)号：SG34299A1
公开(公告)日：1996-12-06
申请号：SG1995001804
申请日：1995-11-10
Applicant: IBM , CARBORUNDUM CO
Inventor： CASEY JON A , CORDERO CARLA N , FASANO BENJAMIN V , GOLAND DAVID B , HANNON ROBERT , HARRIS JONATHAN H , HERRON LESTER W , JOHNSON GREGORY M , PATEL NIRANJAN M , REITTER ANDREW M , SHINDE SUBHASH L , VALLABHANENI RAO V , YOUNGMAN ROBERT A
IPC: B22F7/02 , B32B18/00 , C04B35/581 , C04B37/02 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/48 , H01L23/373 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46
Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.
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公开(公告)号：AU2003293051A1
公开(公告)日：2004-08-10
申请号：AU2003293051
申请日：2003-11-25
Applicant: IBM
Inventor： HUMENIK JAMES N , KNICKERBOCKER JOHN U , VALLABHANENI RAO V , GOVINDARAJAN NATARAJAN , AHMAD UMAR , BEZAMA RASHID J
Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.
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公开(公告)号：CA2072727A1
公开(公告)日：1993-03-11
申请号：CA2072727
申请日：1992-06-29
Applicant: IBM
Inventor： AOUDE FARID Y , DAVID LAWRENCE D , DIVAKARUNI RENUKA S , FAROOQ SHAJI , HERRON LESTER W , LASKY HAL M , MASTREANI ANTHONY , NATARAJAN GOVINDARAJAN , REDDY SRINIVASA S N , SURA VIVEK M , VALLABHANENI RAO V , WALL DONALD R
Abstract: FI9-90-027 COPPER-BASED PASTE CONTAINING COPPER ALUMINATE FOR MICROSTRUCTURAL AND SHRINKAGE CONTROL OF COPPER-FILLED VIAS A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
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