公开(公告)号：EP2671158A4

公开(公告)日：2017-08-30

申请号：EP12741687

申请日：2012-01-31

Applicant: IBM

Inventor： GRUBE GARY W ,  MARKISON TIMOTHY W ,  DHUSE GREG ,  RESCH JASON K ,  VOLVOVSKI ILYA ,  LEGGETTE WESLEY

IPC: G06F12/00 ,  G06F11/10

CPC classification number: G06F11/1076 ,  G06F3/06 ,  G06F3/0604 ,  G06F3/0619 ,  G06F3/0665 ,  G06F3/067 ,  G06F11/00 ,  G06F11/1008 ,  G06F11/1402 ,  G06F11/1446 ,  G06F11/1448 ,  G06F15/17331 ,  G06F21/805 ,  H04L9/085 ,  H04L67/1097

公开(公告)号：EP3005786A4

公开(公告)日：2016-12-28

申请号：EP14804193

申请日：2014-05-30

Applicant: IBM

Inventor： VOLVOVSKI ILYA ,  GLADWIN S CHRISTOPHER ,  GRUBE GARY W ,  MARKISON TIMOTHY W ,  RESCH JASON K ,  SHIRLEY JR THOMAS FRANKLIN ,  DHUSE GREG ,  MOTWANI MANISH ,  BAPTIST ANDREW ,  LEGGETTE WESLEY

IPC: H04W28/14 ,  G06F3/06 ,  G06F11/10 ,  G06F11/14 ,  G06F11/30 ,  G06F11/34

CPC classification number: G06F11/1092 ,  G06F3/06 ,  G06F3/0619 ,  G06F3/064 ,  G06F3/0659 ,  G06F3/067 ,  G06F11/1453 ,  G06F11/1456 ,  G06F11/1458 ,  G06F11/3034 ,  G06F11/3419 ,  G06F11/3433 ,  G06F11/3485 ,  G06F11/349 ,  G06F2211/1028 ,  H04L67/10

Abstract: A method begins by a dispersed storage (DS) processing module of a dispersed storage network (DSN) monitoring network traffic within the DSN. When the network traffic compares unfavorably to a desired network traffic function, the method continues with the DS processing module reducing a portion of the network traffic due to rebuilding flagged encoded data slices by at least one of changing rebuilding criteria for the flagged encoded data slices and changing rebuilding network traffic protocols.

公开(公告)号：DE69015491T2

公开(公告)日：1995-07-20

申请号：DE69015491

申请日：1990-06-16

Applicant: IBM

Inventor： BOOTH RICHARD B ,  GRUBE GARY W ,  GRUBER PETER A ,  KHANDROS IGOR Y ,  ZINGHER ARTHUR R

IPC: H05K7/20 ,  B22F1/02 ,  B23K35/20 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  H01L23/36 ,  H01L23/373

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

公开(公告)号：CA2018930A1

公开(公告)日：1991-02-08

申请号：CA2018930

申请日：1990-06-13

Applicant: IBM

Inventor： BOOTH RICHARD B ,  GRUBE GARY W ,  GRUBER PETER A ,  KHANDROS IGOR Y ,  ZINGHER ARTHUR R

IPC: H05K7/20 ,  B22F1/02 ,  B23K35/20 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  H01L23/36 ,  H01L23/373

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

公开(公告)号：DE69015491D1

公开(公告)日：1995-02-09

申请号：DE69015491

申请日：1990-06-16

Applicant: IBM

Inventor： BOOTH RICHARD B ,  GRUBE GARY W ,  GRUBER PETER A ,  KHANDROS IGOR Y ,  ZINGHER ARTHUR R

IPC: H05K7/20 ,  B22F1/02 ,  B23K35/20 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  H01L23/36 ,  H01L23/373

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.