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公开(公告)号:DE69015491D1
公开(公告)日:1995-02-09
申请号:DE69015491
申请日:1990-06-16
Applicant: IBM
Inventor: BOOTH RICHARD B , GRUBE GARY W , GRUBER PETER A , KHANDROS IGOR Y , ZINGHER ARTHUR R
Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.
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公开(公告)号:DE69206034T2
公开(公告)日:1996-06-20
申请号:DE69206034
申请日:1992-04-11
Applicant: IBM
Inventor: FRANKEL GERALD SIMON , KHANDROS IGOR Y , MADAKSON PETER BITRUS
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公开(公告)号:DE69015491T2
公开(公告)日:1995-07-20
申请号:DE69015491
申请日:1990-06-16
Applicant: IBM
Inventor: BOOTH RICHARD B , GRUBE GARY W , GRUBER PETER A , KHANDROS IGOR Y , ZINGHER ARTHUR R
Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.
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公开(公告)号:DE69029024T2
公开(公告)日:1997-04-30
申请号:DE69029024
申请日:1990-08-29
Applicant: IBM
Inventor: BASEMAN ROBERT J , JAHNES CHRISTOPHER V , KHANDROS IGOR Y , MIRZAMAANI SEYYED M , RUSSAK MICHAEL A
Abstract: A magnetic storage medium is composed of a non-wettable substrate (10) upon which a transient liquid metal layer (18) is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer (14) is deposited on the transient liquid metal layer (18) resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer (18).
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公开(公告)号:DE69029024D1
公开(公告)日:1996-12-05
申请号:DE69029024
申请日:1990-08-29
Applicant: IBM
Inventor: BASEMAN ROBERT J , JAHNES CHRISTOPHER V , KHANDROS IGOR Y , MIRZAMAANI SEYYED M , RUSSAK MICHAEL A
Abstract: A magnetic storage medium is composed of a non-wettable substrate (10) upon which a transient liquid metal layer (18) is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer (14) is deposited on the transient liquid metal layer (18) resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer (18).
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公开(公告)号:CA2018930A1
公开(公告)日:1991-02-08
申请号:CA2018930
申请日:1990-06-13
Applicant: IBM
Inventor: BOOTH RICHARD B , GRUBE GARY W , GRUBER PETER A , KHANDROS IGOR Y , ZINGHER ARTHUR R
Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.
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公开(公告)号:DE69206034D1
公开(公告)日:1995-12-21
申请号:DE69206034
申请日:1992-04-11
Applicant: IBM
Inventor: FRANKEL GERALD SIMON , KHANDROS IGOR Y , MADAKSON PETER BITRUS
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