1.
    发明专利
    未知

    公开(公告)号:DE69015491D1

    公开(公告)日:1995-02-09

    申请号:DE69015491

    申请日:1990-06-16

    Applicant: IBM

    Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

    3.
    发明专利
    未知

    公开(公告)号:DE69015491T2

    公开(公告)日:1995-07-20

    申请号:DE69015491

    申请日:1990-06-16

    Applicant: IBM

    Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

    LIQUID METAL MATRIX THERMAL PASTE

    公开(公告)号:CA2018930A1

    公开(公告)日:1991-02-08

    申请号:CA2018930

    申请日:1990-06-13

    Applicant: IBM

    Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

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