公开(公告)号：DE69015491T2

公开(公告)日：1995-07-20

申请号：DE69015491

申请日：1990-06-16

Applicant: IBM

Inventor： BOOTH RICHARD B ,  GRUBE GARY W ,  GRUBER PETER A ,  KHANDROS IGOR Y ,  ZINGHER ARTHUR R

IPC: H05K7/20 ,  B22F1/02 ,  B23K35/20 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  H01L23/36 ,  H01L23/373

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

公开(公告)号：CA2018930A1

公开(公告)日：1991-02-08

申请号：CA2018930

申请日：1990-06-13

Applicant: IBM

Inventor： BOOTH RICHARD B ,  GRUBE GARY W ,  GRUBER PETER A ,  KHANDROS IGOR Y ,  ZINGHER ARTHUR R

IPC: H05K7/20 ,  B22F1/02 ,  B23K35/20 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  H01L23/36 ,  H01L23/373

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

公开(公告)号：DE69015491D1

公开(公告)日：1995-02-09

申请号：DE69015491

申请日：1990-06-16

Applicant: IBM

Inventor： BOOTH RICHARD B ,  GRUBE GARY W ,  GRUBER PETER A ,  KHANDROS IGOR Y ,  ZINGHER ARTHUR R

IPC: H05K7/20 ,  B22F1/02 ,  B23K35/20 ,  B23K35/22 ,  B23K35/26 ,  C22C1/02 ,  H01L23/36 ,  H01L23/373

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles (12) in a low melting temperature liquid metal matrix (14). The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100 DEG C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary, eutectic. The particles (12) may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.