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公开(公告)号:JPH0864939A
公开(公告)日:1996-03-08
申请号:JP18239594
申请日:1994-08-03
Applicant: IBM
Inventor: NAKANISHI TORU , OKUMA HIDEO
Abstract: PURPOSE: To prevent the generation of a solder bridge which is easily generated, when a component of a terminal of narrow pitch is soldered. CONSTITUTION: An excess solder absorption region 24 which is not provided with a solder resist 20 is provided to a tip side of a terminal 14, rather than to an end part 22A of a solder pad 22 in the solder resist 20. If much solder paste is attached on the solder pad 22 when the terminal 14 is soldered, excess solder 28 which is fused by the heat of a heating heater travels through a terminal 14 and flows to the tip direction of the terminal 14, inside an excess solder- absorbing region 24. Since the excess solder 28 does not go over the solder resist 20 between the terminals 14, a solder bridge is not formed.
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公开(公告)号:JP2002260478A
公开(公告)日:2002-09-13
申请号:JP2001056321
申请日:2001-03-01
Applicant: IBM
Inventor: KAMEI NOBUYUKI , NAKANISHI TORU , KITANAKA AKIHIKO
IPC: G06F1/26 , G06F1/16 , G06F3/02 , H01H13/02 , H01H13/14 , H01H13/702 , H01L35/28 , H01L35/32 , H01H13/70
Abstract: PROBLEM TO BE SOLVED: To provide a keyboard that a user can recognize the keys of a notebook personal computer even if it is used in the dark in an airplane and the like. SOLUTION: The keyboard 10 comprises a board 34, a membrane 30, an elastic member 17, a cover sheet 22, and key tops 12, all made of light transmitting material, and is also provided with a light emitting means 39 emitting light from under the board 34 toward the key tops 12. As the key tops are illuminated, the characters displayed on the key surfaces 56 of the key tops 12 become recognizable, so that a key operation error can be prevented. A thermoelectric generating element 42 is used as the power source for emitting the light from the light emitting means 39, so that the working time of the battery of the notebook personal computer is not reduced by the illumination.
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公开(公告)号:JP2000349481A
公开(公告)日:2000-12-15
申请号:JP11054599
申请日:1999-04-19
Applicant: IBM
Inventor: TERADA HIROTO , NAKANISHI TORU , KAWASE MOTOKAZU
IPC: H05K7/20 , G06F1/20 , H01L23/427 , H01L23/467
Abstract: PROBLEM TO BE SOLVED: To enable mounting of an MPU having high performance by improving cooling effect of a notebook personal computer. SOLUTION: A cooling device 11 for a computer is constituted by a housing 14 constituted differently from a notebook personal computer 12, a heat pipe 18 for absorbing heat generated in an MPU 16 which is a heat generating element in the personal computer 12 and for allowing the heat to move into the housing 14, and a heat dissipating means 20 for dissipating the heat moved into the housing 14 to the outside of the housing 14.
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公开(公告)号:JP2000349479A
公开(公告)日:2000-12-15
申请号:JP10763599
申请日:1999-04-15
Applicant: IBM
Inventor: NAKANISHI TORU , NISHIO TOSHIHIKO
IPC: H05K7/20 , G06F1/20 , H01L23/38 , H01L23/427
Abstract: PROBLEM TO BE SOLVED: To prevent a user from feeling uncomfortable due to heat generated in a personal computer. SOLUTION: A heat control device 10 for a computer is constituted of a heat pipe 24 for allowing heat generated in an MPU 18 of a computer 12 to move to around upper face 20 and around lower face 22 of a main body 14, heat dissipating means 28a and 28b for dissipating heat at around the upper face 20 and around the lower face 22, and a volume switch 30 for adjusting an amount of heat absorbed by a Peltier element 34a from a heat spreader 32.
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公开(公告)号:JP2008147596A
公开(公告)日:2008-06-26
申请号:JP2006336256
申请日:2006-12-13
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor: TANAHASHI TAKASHIGE , NAKANISHI TORU
CPC classification number: H01L23/4334 , H01L23/16 , H01L23/3128 , H01L2224/16225 , H01L2224/73204 , H01L2924/00014 , H01L2924/15311 , H01L2924/18161 , H01L2224/32225 , H01L2924/00012 , H01L2224/0401
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor package capable of decreasing influence which thermal fluctuation has on curvature or the like of a substrate.
SOLUTION: A semiconductor package 100 comprises: a substrate 10 having a plurality of electrode pads on the surface; a semiconductor chip 13 placed on the substrate so as to be electrically connected to the plurality of electrode pads; and a stiffener 17 placed on the substrate so as to surround the circumference of the semiconductor chip, where the stiffener includes an insulating material layer 21 and a stiffness board 23 placed in the insulating material layer so as to be substantially parallel to the surface of the substrate, a plurality of through-holes 32 are formed in the stiffness board, and at least a part of the though-holes are filled with insulation material.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 解决的问题:提供能够降低热波动对基板的曲率等的影响的半导体封装。 解决方案:半导体封装100包括:表面上具有多个电极焊盘的衬底10; 放置在所述基板上以与多个电极焊盘电连接的半导体芯片13; 以及设置在基板上以围绕半导体芯片的圆周的加强件17,其中加强件包括绝缘材料层21和刚性板23,绝缘材料层21和刚性板23放置在绝缘材料层中,以便基本平行于 在刚性板上形成多个通孔32,至少一部分通孔被绝缘材料填充。 版权所有(C)2008,JPO&INPIT
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公开(公告)号:JP2000277964A
公开(公告)日:2000-10-06
申请号:JP8168899
申请日:1999-03-25
Applicant: IBM
Inventor: NAKANISHI TORU , YAMADA YASUHARU , KUZUNO MASANORI , NISHIO TOSHIHIKO
Abstract: PROBLEM TO BE SOLVED: To prevent the height from being increased to efficiency cool a heat generation object, while power consumption for cooling is saved for efficiently cooling the heat generating object of a CPU emitting a high temperature with the increase of power consumption for making performance high. SOLUTION: This cooling device 10 of a notebook personal computer is constituted by comprising a heat sink 14 which heat-conducts a part of heat emitted from the heat generating object 12 of the notebook personal computer to a position different from the heat generating object 12, a heat transfer means 16 which forcedly transfers the remainder of heat emitted from the heat generation object 12 to a position different from the heat generating object 12 and forcible heat generating means 22 and 28 which compulsorily radiate heat.
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公开(公告)号:JP2000283526A
公开(公告)日:2000-10-13
申请号:JP8206699
申请日:1999-03-25
Applicant: IBM
Inventor: NAKANISHI TORU , TERADA HIROTO , KAWASE MOTOKAZU
Abstract: PROBLEM TO BE SOLVED: To keep uniform temperature inside a computer room by judging whether temperature obtained by simulation is within a specific temperature range or not, and by controlling at least one of wind directions of a fan for covering a position at a temperature that does not exist within the specific temperature range. SOLUTION: Based on temperature, the amount of the wind of a fan, and a wind direction, simulation is carried out, and temperature distribution is obtained. Under the control of a local PC 70, a circuit 76 for controlling the amount of wind controls the speed of a specified fan, and the amount of wind, namely, the force of wind. A circuit 78 for controlling an air conditioner controls the air conditioner according to the state of temperature. For example, when temperature inside a computer room is lower than a specific temperature range, the air conditioner is temporally stopped, or the air conditioner is operated by high power when cooling effect by the fan is low. A circuit 80 for controlling a stator position selectively drives the coil winding of the stator of the specified fan, and controls the wind direction of the fan under the control of the local PC 70.
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公开(公告)号:JP2000267764A
公开(公告)日:2000-09-29
申请号:JP6984999
申请日:1999-03-16
Applicant: IBM
Inventor: NAKANISHI TORU , NISHIO TOSHIHIKO
Abstract: PROBLEM TO BE SOLVED: To make mountable a CPU or an MPU of the highest speed on a portable computer and to improve the performance of the computer by transmit ting the heat of a heat generating body contained in the computer to a carrying tool and discharges the heat of the carrying tool into the air to properly cool the heat generating body. SOLUTION: Heat transfer bodies 22 are placed at the areas corresponding to one or plural heat generating bodies 20 of a portable computer 12 so as to touch these bodies 20 respectively. The transfer body 22 functions to protect each heat generating bodies 20 and also to lower the temperature of the heat generating bodies 20. A window 24 is formed to expose the other side of the transmitter 22 to the outside, so that the heat of the bodies 20 is transferred to the outside through the window 24. Heat absorbers 26 are placed at the positions corresponding to the heat transfer bodies 22 of the computer 12. Each absorber 26 touches each heat transfer body 22 and leads the internal heat of each heat generating bodies 20 to the outside.
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