公开(公告)号：EP2104136A4

公开(公告)日：2012-03-07

申请号：EP07850933

申请日：2007-12-19

Applicant: IBM

Inventor： OYAMA YUKIFUMI ,  TORIYAMA KAZUSHIGE ,  NISHIWAKI HIDETOSHI ,  ORII YASUMITSU ,  NISHIO TOSHIHIKO

IPC: H01L21/60

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2201/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: After preliminary supply of an equal amount of solder to all of stud-bumps of a semiconductor part, establishing solder connection between the stud-bumps and connecting pads of a circuit substrate. A method for mounting a semiconductor part on a circuit substrate is provided, which includes the steps of preparing the semiconductor part (10) having a surface thereof provided with a plurality of stud-bumps (12), preparing a solder substrate (13) having a surface thereof on which solid-solders (14) corresponding to respective of the plurality of stud-bumps (12) are arranged, preparing the circuit substrate (20) having a surface thereof provided with connecting pads (21) corresponding to respective of the plurality of stud-bumps, attaching, to respective tip ends of the plurality of stud bumps, the corresponding solid-solders on the solder substrate, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective of the tip ends of the stud-bumps with the corresponding connecting pads, and melting the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective of the stud-bumps and the corresponding connecting pads.

公开(公告)号：JP2003330989A

公开(公告)日：2003-11-21

申请号：JP2002137535

申请日：2002-05-13

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： NISHIO TOSHIHIKO ,  ASAI JUNKO ,  MUKAI TOSHIO

IPC: G06F17/50 ,  H05K3/00

CPC classification number: G06F17/50 ,  G06F2217/78 ,  H05K3/0005

Abstract: PROBLEM TO BE SOLVED: To enable the selection of a printed wiring board suitable to the purpose of application, from board information by the purpose of using the printed wiring board, information on parts to be mounted and an outer diameter size of the printed wiring board, at a stage before arrangement of the parts.
SOLUTION: The present invention comprises an input part 12 for entering information, a memory part 16 for storing the information, an operation part 14 for operation using the information stored in the memory part 16, a display part 20, and a control part 18, and the printed wiring board 30 is selected by acquiring an index at the operation part 14.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了能够根据印刷电路板的目的从板信息中选择适合于应用目的的印刷电路板，关于要安装的部件的信息和外部尺寸的 印刷电路板，在安装零件之前的阶段。 解决方案：本发明包括用于输入信息的输入部分12，用于存储信息的存储部分16，使用存储在存储部分16中的信息进行操作的操作部分14，显示部分20和控制 部分18，并且通过获取操作部分14的索引来选择印刷线路板30.版权所有：（C）2004，JPO

公开(公告)号：JP2000277964A

公开(公告)日：2000-10-06

申请号：JP8168899

申请日：1999-03-25

Applicant: IBM

Inventor： NAKANISHI TORU ,  YAMADA YASUHARU ,  KUZUNO MASANORI ,  NISHIO TOSHIHIKO

IPC: H05K7/20 ,  G06F1/20

Abstract: PROBLEM TO BE SOLVED: To prevent the height from being increased to efficiency cool a heat generation object, while power consumption for cooling is saved for efficiently cooling the heat generating object of a CPU emitting a high temperature with the increase of power consumption for making performance high. SOLUTION: This cooling device 10 of a notebook personal computer is constituted by comprising a heat sink 14 which heat-conducts a part of heat emitted from the heat generating object 12 of the notebook personal computer to a position different from the heat generating object 12, a heat transfer means 16 which forcedly transfers the remainder of heat emitted from the heat generation object 12 to a position different from the heat generating object 12 and forcible heat generating means 22 and 28 which compulsorily radiate heat.

公开(公告)号：JP2001034643A

公开(公告)日：2001-02-09

申请号：JP19461199

申请日：1999-07-08

Applicant: IBM

Inventor： NISHIO TOSHIHIKO ,  NAKAMURA SHINJI

IPC: H05K3/00 ,  G06F17/50

Abstract: PROBLEM TO BE SOLVED: To select an optimum grade of a printed circuit board according to the ratio of the total wiring length that is possible to be wired on the circuit board to the total wiring length to be wired on the board. SOLUTION: An input part 32 inputs the information on a printed circuit board to be designed, the information on the parts to be mounted on the circuit board and the parts connection information, a storage part 38 stores the information which are acquired from the past designs of circuit board in addition to the said circuit board information, parts information and connection information, a display part 36 displays various types of design information including those inputted information and an operation/control part 34 which carries out a prescribed operational processing by means of various information stored in the part 38 and also controls the parts 32, 36 and 38 respectively are included. In such a constitution, the ratio is found, from those information of the part 38, of the total wiring length that is possible to be wired on the circuit board to the total wiring length that is necessary for connecting the parts together and a grade of the circuit board is selected according to this decided rate.

公开(公告)号：JP2008078333A

公开(公告)日：2008-04-03

申请号：JP2006254969

申请日：2006-09-20

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： OYAMA YUKIFUMI ,  ORII YASUMITSU ,  NISHIO TOSHIHIKO

IPC: H01L21/304 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L21/6835 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01065 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To decrease the thickness of a semiconductor part (chip) on a substrate to a specified value, regardless of variation in thickness of a substrate, in a semiconductor product. SOLUTION: In a semiconductor component installed on a base plate 32, a surface 30 of a semiconductor part 29 on a substrate 28 is set at a specified height h from a surface 33 of the base plate 32. By machining the surface 30 of the semiconductor part 29 that has been adjusted to the specified height h, the thickness of the semiconductor part 29 on the substrate 28 is made to be a specified value without exception. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：在半导体产品中，将基板上的半导体部件（芯片）的厚度减小到规定值，而不管基板厚度的变化。 解决方案：在安装在基板32上的半导体部件中，将基板28上的半导体部件29的表面30从基板32的表面33设定在规定的高度h。通过机械加工表面30 已调整到规定高度h的半导体部件29的厚度使基板28上的半导体部件29的厚度成为规定值。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2000349479A

公开(公告)日：2000-12-15

申请号：JP10763599

申请日：1999-04-15

Applicant: IBM

Inventor： NAKANISHI TORU ,  NISHIO TOSHIHIKO

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/38 ,  H01L23/427

Abstract: PROBLEM TO BE SOLVED: To prevent a user from feeling uncomfortable due to heat generated in a personal computer. SOLUTION: A heat control device 10 for a computer is constituted of a heat pipe 24 for allowing heat generated in an MPU 18 of a computer 12 to move to around upper face 20 and around lower face 22 of a main body 14, heat dissipating means 28a and 28b for dissipating heat at around the upper face 20 and around the lower face 22, and a volume switch 30 for adjusting an amount of heat absorbed by a Peltier element 34a from a heat spreader 32.

公开(公告)号：JP2000267764A

公开(公告)日：2000-09-29

申请号：JP6984999

申请日：1999-03-16

Applicant: IBM

Inventor： NAKANISHI TORU ,  NISHIO TOSHIHIKO

IPC: F28D15/02 ,  G06F1/16 ,  G06F1/20 ,  H01L23/427 ,  H05K5/02 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To make mountable a CPU or an MPU of the highest speed on a portable computer and to improve the performance of the computer by transmit ting the heat of a heat generating body contained in the computer to a carrying tool and discharges the heat of the carrying tool into the air to properly cool the heat generating body. SOLUTION: Heat transfer bodies 22 are placed at the areas corresponding to one or plural heat generating bodies 20 of a portable computer 12 so as to touch these bodies 20 respectively. The transfer body 22 functions to protect each heat generating bodies 20 and also to lower the temperature of the heat generating bodies 20. A window 24 is formed to expose the other side of the transmitter 22 to the outside, so that the heat of the bodies 20 is transferred to the outside through the window 24. Heat absorbers 26 are placed at the positions corresponding to the heat transfer bodies 22 of the computer 12. Each absorber 26 touches each heat transfer body 22 and leads the internal heat of each heat generating bodies 20 to the outside.