公开(公告)号：JPS62101034A

公开(公告)日：1987-05-11

申请号：JP19302286

申请日：1986-08-20

Applicant: IBM

Inventor： BEYER KLAUS DIETRICH ,  MAKRIS JAMES STEVE ,  MENDEL ERIC ,  NUMMY KAREN ANN ,  OGURA SEIKI ,  RISEMAN JACOB ,  ROVEDO NIVO

IPC: H01L21/76 ,  H01L21/302 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/3105 ,  H01L21/74 ,  H01L21/762 ,  H01L21/763

公开(公告)号：DE3681696D1

公开(公告)日：1991-10-31

申请号：DE3681696

申请日：1986-07-29

Applicant: IBM

Inventor： BEYER KLAUS DIETRICH ,  MAKRIS JAMES STEVE ,  MENDEL ERIC ,  NUMMY KAREN ANN ,  OGURA SEIKI ,  RISEMAN JACOB ,  ROVEDO NIVO

IPC: H01L21/76 ,  H01L21/302 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/3105 ,  H01L21/74 ,  H01L21/762 ,  H01L21/763

Abstract: A chemical-mechanical (chem-mech) method for removing SiO₂ protuberances at the surface of a silicon chip, such protuberances including "bird heads". A thin etch stop layer of Si₃N₄ (29) is deposited onto the wafer surface, which is then chem-mech polished with a SiO₂ water based slurry. The Si₃N₄ acts as a polishing or etch stop barrier layer only on the planar portions of the wafer surface. The portions of the Si₃N₄ layer located on the top and at the sidewalls of the "bird' heads" and the underlying SiO₂ protuberances are removed to provide a substantially planar integrated structure.