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公开(公告)号:JPS62101034A
公开(公告)日:1987-05-11
申请号:JP19302286
申请日:1986-08-20
Applicant: IBM
Inventor: BEYER KLAUS DIETRICH , MAKRIS JAMES STEVE , MENDEL ERIC , NUMMY KAREN ANN , OGURA SEIKI , RISEMAN JACOB , ROVEDO NIVO
IPC: H01L21/76 , H01L21/302 , H01L21/306 , H01L21/3065 , H01L21/3105 , H01L21/74 , H01L21/762 , H01L21/763
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公开(公告)号:JPS6118147A
公开(公告)日:1986-01-27
申请号:JP8151885
申请日:1985-04-18
Applicant: Ibm
Inventor: GOTH GEORGE RICHARD , HANSEN THOMAS ADRIAN , MAKRIS JAMES STEVE
IPC: H01L21/761 , H01L21/302 , H01L21/3065 , H01L21/74 , H01L21/76 , H01L21/762 , H01L29/41
CPC classification number: H01L21/76224 , H01L21/743
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公开(公告)号:DE3681696D1
公开(公告)日:1991-10-31
申请号:DE3681696
申请日:1986-07-29
Applicant: IBM
Inventor: BEYER KLAUS DIETRICH , MAKRIS JAMES STEVE , MENDEL ERIC , NUMMY KAREN ANN , OGURA SEIKI , RISEMAN JACOB , ROVEDO NIVO
IPC: H01L21/76 , H01L21/302 , H01L21/306 , H01L21/3065 , H01L21/3105 , H01L21/74 , H01L21/762 , H01L21/763
Abstract: A chemical-mechanical (chem-mech) method for removing SiO₂ protuberances at the surface of a silicon chip, such protuberances including "bird heads". A thin etch stop layer of Si₃N₄ (29) is deposited onto the wafer surface, which is then chem-mech polished with a SiO₂ water based slurry. The Si₃N₄ acts as a polishing or etch stop barrier layer only on the planar portions of the wafer surface. The portions of the Si₃N₄ layer located on the top and at the sidewalls of the "bird' heads" and the underlying SiO₂ protuberances are removed to provide a substantially planar integrated structure.
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公开(公告)号:ES2084575T3
公开(公告)日:1996-05-16
申请号:ES87104307
申请日:1987-03-24
Applicant: IBM
Inventor: FULTON INGE GRUMM , MAKRIS JAMES STEVE , NASTASI VICTOR RAY , SCADUTO ANTHONY FRANCIS , SHARTEL ANNE CHARLENE
IPC: H01L21/76 , H01L21/74 , H01L21/762 , H01L21/763 , H01L21/31
Abstract: Disclosed is a process of growing a conformal and etch-resistant silicon dioxide on a surface by forming a conformal layer of polysilicon and subjecting the polysilicon to thermal oxidation to completely convert the polysilicon into (poly) silicon oxide. Disclosed also is a method of forming an isolation trench in a semiconductor substrate having a high integrity oxide sidewall. After forming the trench (58) in the substrate surface using a suitable etch mask and RIE, a single (thermal) oxide or dual (thermal) oxide and (CVD) nitride liner (64) is formed on all trench surfaces. A conformal layer of undoped polysilicon (66) is then formed (by. e.g. LPCVD) on the liner. By subjecting to thermal oxidation, the polysilicon is completely converted into a conformal (poly) silicon oxide layer (68) having a thickness about 2.5 times that of the polysilicon layer. The resulting (poly) silicon oxide has the conformality of CVD oxide and the high etch resistance of thermally grown oxide. Alternatively, prior to forming the (poly) silicon oxide, the polysilicon layer is removed from the trench floor and the substrate surface in order to limit volume expansion of the polysilicon to a single direction perpendicular to the trench walls. The trench is filled with oxide, epitaxial silicon, polysilicon, polymers or metal, as desired. For achieving substrate contact through the trench, the trench bottom is opened up by RIE. Polysilicon is deposited with in-situ doping at a high temperature to fill the trench and simultaneously diffuse the dopant from the polysilicon fill into the underlying substrate to form a channel stop.
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公开(公告)号:DE3062705D1
公开(公告)日:1983-05-19
申请号:DE3062705
申请日:1980-05-13
Applicant: IBM
Inventor: BARILE CONRAD ALBERT , GOTH GEORGE RICHARD , MAKRIS JAMES STEVE , NAGARAJAN ARUNACHALA , RAHEJA RAJ KANWAL
IPC: H01L29/73 , H01L21/033 , H01L21/265 , H01L21/331 , H01L21/76 , H01L21/8222 , H01L27/06 , H01L27/07 , H01L29/417 , H01L21/00
Abstract: A very high current ion implanted emitter is formed in a diffused base. Windows are made through the silicon nitride and silicon dioxide layes to both the base contact and the emitter regions using a resist mask. These regions are then protected by resist and the collector contact window is opened through the remainder of the silicon dioxide layer to the reach through region. A screen oxide is then grown in all the exposed areas after the removal of the resist mask. A resist mask is applied which covers only the base and Schottky anode regions. Arsenic is then implanted through the exposed screened areas followed by an etch back step to remove the top damaged layer. With some remaining screen oxide serving as a cap, the emitter drive-in is done.
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公开(公告)号:DE3586554D1
公开(公告)日:1992-10-01
申请号:DE3586554
申请日:1985-06-03
Applicant: IBM
Inventor: GOTH GEORGE RICHARD , HANSEN THOMAS ADRIAN , MAKRIS JAMES STEVE
IPC: H01L21/761 , H01L21/302 , H01L21/3065 , H01L21/74 , H01L21/76 , H01L21/762 , H01L29/41
Abstract: Deep trenches (14, 15) are formed according to the desired pattern through the N epitaxial layer (13) and N + subcollector region (12) into the P- substrate (11) of a silicon structure (10). Where a substrate contact is needed, the trenches delineate a central stud (16) or mesa of silicon material. Channel stop regions (18) are formed e.g. by ion implantation of boron atoms at the bottom of trenches. Si0 2 and Si 3 N 4 layers (17, 19) are then deposited on the whole structure. A substrate contact mask is applied and patterned to selectively expose one side of the trench sidewalls, the bottom of the trenches adjacent thereto and others areas if desired such as the top surface of the stud. The composite SiO 2 /Si 3 N 4 layer is then etched to leave exposed only the sidewalls of the stud, at least partially the bottom of the trenches adjacent thereto and the top surface of the stud. Platinum is deposited preferably via sputter deposition, conformally coating all regions of the structure. After sintering, the unreacted platinum is removed using wet chemical etch (aqua regia). Platinum silicide is left in all opened contacts and on the stud sidewalls where its defines a metal silicide lining (25) or cap, covering the stud. This lining connects the top surface (25a) of the stud, with the channel stop implanted regions (18) and thence forms the desired substrate contact.
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公开(公告)号:IT1149957B
公开(公告)日:1986-12-10
申请号:IT2199580
申请日:1980-05-13
Applicant: IBM
Inventor: BARILE CONRAD ALBERT , GOTH GEORGE RICHARD , MAKRIS JAMES STEVE , NAGARAJAN ARUNACHALA , RAHEJA RAJ KANWAL
IPC: H01L29/73 , H01L21/033 , H01L21/265 , H01L21/331 , H01L21/76 , H01L21/8222 , H01L27/06 , H01L27/07 , H01L29/417
Abstract: A very high current ion implanted emitter is formed in a diffused base. Windows are made through the silicon nitride and silicon dioxide layes to both the base contact and the emitter regions using a resist mask. These regions are then protected by resist and the collector contact window is opened through the remainder of the silicon dioxide layer to the reach through region. A screen oxide is then grown in all the exposed areas after the removal of the resist mask. A resist mask is applied which covers only the base and Schottky anode regions. Arsenic is then implanted through the exposed screened areas followed by an etch back step to remove the top damaged layer. With some remaining screen oxide serving as a cap, the emitter drive-in is done.
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公开(公告)号:DE3586554T2
公开(公告)日:1993-04-08
申请号:DE3586554
申请日:1985-06-03
Applicant: IBM
Inventor: GOTH GEORGE RICHARD , HANSEN THOMAS ADRIAN , MAKRIS JAMES STEVE
IPC: H01L21/761 , H01L21/302 , H01L21/3065 , H01L21/74 , H01L21/76 , H01L21/762 , H01L29/41
Abstract: Deep trenches (14, 15) are formed according to the desired pattern through the N epitaxial layer (13) and N + subcollector region (12) into the P- substrate (11) of a silicon structure (10). Where a substrate contact is needed, the trenches delineate a central stud (16) or mesa of silicon material. Channel stop regions (18) are formed e.g. by ion implantation of boron atoms at the bottom of trenches. Si0 2 and Si 3 N 4 layers (17, 19) are then deposited on the whole structure. A substrate contact mask is applied and patterned to selectively expose one side of the trench sidewalls, the bottom of the trenches adjacent thereto and others areas if desired such as the top surface of the stud. The composite SiO 2 /Si 3 N 4 layer is then etched to leave exposed only the sidewalls of the stud, at least partially the bottom of the trenches adjacent thereto and the top surface of the stud. Platinum is deposited preferably via sputter deposition, conformally coating all regions of the structure. After sintering, the unreacted platinum is removed using wet chemical etch (aqua regia). Platinum silicide is left in all opened contacts and on the stud sidewalls where its defines a metal silicide lining (25) or cap, covering the stud. This lining connects the top surface (25a) of the stud, with the channel stop implanted regions (18) and thence forms the desired substrate contact.
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公开(公告)号:DE2531003A1
公开(公告)日:1976-02-05
申请号:DE2531003
申请日:1975-07-11
Applicant: IBM DEUTSCHLAND
Inventor: KOENIG WILFRIED GUSTAF , MAKRIS JAMES STEVE , MASTERS BURTON JOSEPH
IPC: H01L29/73 , H01L21/265 , H01L21/331 , H01L21/74
Abstract: A method of ion implantation into a semiconductor substrate which comprises forming a layer of an electrically insulative material, such as silicon dioxide, on the substrate over the region to be ion implanted. Then, a beam of ions having sufficient energy to pass through the layer of insulative material and to penetrate into the substrate is directed at a particular portion of the insulative layer. Before proceeding further, at least the upper half of the insulative layer, and preferably all of the upper portion of the insulative layer, in excess of a remaining thickness of 100A, is removed by etching. Then, the substrate is heated whereby the ions are driven further into the substrate to form the selected ion implanted region.
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公开(公告)号:DE3751732T2
公开(公告)日:1996-09-26
申请号:DE3751732
申请日:1987-03-24
Applicant: IBM
Inventor: FULTON INGE GRUMM , MAKRIS JAMES STEVE , NASTASI VICTOR RAY , SCADUTO ANTHONY FRANCIS , SHARTEL ANNE CHARLENE
IPC: H01L21/76 , H01L21/74 , H01L21/762 , H01L21/763 , H01L21/31
Abstract: Disclosed is a process of growing a conformal and etch-resistant silicon dioxide on a surface by forming a conformal layer of polysilicon and subjecting the polysilicon to thermal oxidation to completely convert the polysilicon into (poly) silicon oxide. Disclosed also is a method of forming an isolation trench in a semiconductor substrate having a high integrity oxide sidewall. After forming the trench (58) in the substrate surface using a suitable etch mask and RIE, a single (thermal) oxide or dual (thermal) oxide and (CVD) nitride liner (64) is formed on all trench surfaces. A conformal layer of undoped polysilicon (66) is then formed (by. e.g. LPCVD) on the liner. By subjecting to thermal oxidation, the polysilicon is completely converted into a conformal (poly) silicon oxide layer (68) having a thickness about 2.5 times that of the polysilicon layer. The resulting (poly) silicon oxide has the conformality of CVD oxide and the high etch resistance of thermally grown oxide. Alternatively, prior to forming the (poly) silicon oxide, the polysilicon layer is removed from the trench floor and the substrate surface in order to limit volume expansion of the polysilicon to a single direction perpendicular to the trench walls. The trench is filled with oxide, epitaxial silicon, polysilicon, polymers or metal, as desired. For achieving substrate contact through the trench, the trench bottom is opened up by RIE. Polysilicon is deposited with in-situ doping at a high temperature to fill the trench and simultaneously diffuse the dopant from the polysilicon fill into the underlying substrate to form a channel stop.
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