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12 records (took 0.043 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE68920923T2

    公开(公告)日：1995-08-10

    申请号：DE68920923

    申请日：1989-05-12

    Applicant: IBM

    Inventor： FUNARI JOSEPH ,  GREEN MARY CERNY ,  REYNOLDS SCOTT DAVID ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

    Abstract: An electronic package (10) including a first substrate (11) (e.g., printed circuit board), a semiconductor device (13) (e.g., silicon chip), a second circuitized substrate (15) (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (41) (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

    3.
    发明专利
    未知

    公开(公告)号：DE68923740D1

    公开(公告)日：1995-09-14

    申请号：DE68923740

    申请日：1989-05-13

    Applicant: IBM

    Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/42

    Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

    Assembly mount supporting a heat sink
    4.
    发明专利
    Assembly mount supporting a heat sink 未知

    公开(公告)号：CZ290327B6

    公开(公告)日：2002-07-17

    申请号：CZ324497

    申请日：1997-10-13

    Applicant: IBM

    Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/40

    Abstract: The present invention relates to an assembly mount supporting a heat sink (16) relative to a surface of an electronic device (15) on a substrate (13) to enable heat to pass from said device (15) to said heat sink (16). The invented assembly mount comprises at least two flexible, retention posts (11, 12) affixed to members secured to a surface of the substrate (13) at a predetermined angle and each of said flexible, retention post (11, 12) has two ends, one of said ends being removably affixed to said surface of said substrate (13), and the other of said ends having means frictionally engaging and supporting the heat sink (16) in such a manner that said heat sink (16) is supported in a close, heat transferring position relative to said electronic device (15).

    9.
    发明专利
    未知

    公开(公告)号：DE68923740T2

    公开(公告)日：1996-04-18

    申请号：DE68923740

    申请日：1989-05-13

    Applicant: IBM

    Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/42

    Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

    10.
    发明专利
    未知

    公开(公告)号：AT126396T

    公开(公告)日：1995-08-15

    申请号：AT89108688

    申请日：1989-05-13

    Applicant: IBM

    Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/42

    Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

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