公开(公告)号：US6373703B2

公开(公告)日：2002-04-16

申请号：US75364201

申请日：2001-01-03

Applicant: IBM

Inventor： JOHNSON ERIC ARTHUR ,  KOSTEVA STEPHEN JOHN ,  MACQUARRIE STEPHEN WESLEY

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L24/48 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2924/00012

Abstract: An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.

Abstract translation: 一种将散热器连接到包括基板的电子封装的表面的装置和方法，附接到基板的表面的集成电路芯片，封装集成电路芯片并与基板表面的至少一部分接触的密封剂， 以及形成在密封剂的顶部中的孔，以将散热器附接到电子封装的表面。 可以根据需要安装和拆卸散热器以允许包装识别或返工。

公开(公告)号：SG59997A1

公开(公告)日：1999-02-22

申请号：SG1996009698

申请日：1996-05-03

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  PASSANTE DAVID MICHAEL ,  RUDIK WILLIAM JOHN ,  RUSSELL DAVID JOHN ,  WHITCOMB JONATHAN CRAIG

IPC: H01L21/60 ,  H01L21/00

Abstract: A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.

公开(公告)号：HU9701129A2

公开(公告)日：1998-06-29

申请号：HU9701129

申请日：1997-06-30

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/40 ,  H05K7/20

公开(公告)号：MY117421A

公开(公告)日：2004-06-30

申请号：MYPI9804474

申请日：1998-09-30

Applicant: IBM

Inventor： JOHNSON ERIC ARTHUR ,  KOSTEVA STEPHEN JOHN ,  MACQUARRIE STEPHEN WESLEY

IPC: H05K7/20 ,  H01L23/40

Abstract: AN APPARATUS AND METHOD ATTACHING A HEATSINK (214) TO A SURFACE OF AN ELECTRONIC PACKAGE (200, 300, 300, 500, 600) COMPRISING A SUBSTRATE (202), AN INTEGRATED CIRCUIT CHIP (204) ATTACHED TO THE SURFACE OF THE SUBSTRATE, AN ENCAPSULANT (206, 226, 306, 326, 406, 506, 606) ENCAPSULATING THE INTEGRATED CIRCUIT CHIP AND CONTACTING AT LEAST A PORTION OF THE SURFACE OF THE SUBSTRATE, AND AN ORIFICE (208, 308) FORMED IN THE TOP PORTION OF THE ENCAPSULANT TO ATTACH THE HEATSINK TO THE SURFACE OF THE ELECTRONIC PACKAGE. THE HEATSINK MAY BE ATTACHED AND REMOVED AS DESIRED TO ALLOW FOR PACKAGE IDENTIFICATION OR REWORK.

公开(公告)号：CZ9703244A3

公开(公告)日：2002-03-13

申请号：CZ324497

申请日：1997-10-13

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/40

公开(公告)号：CZ290327B6

公开(公告)日：2002-07-17

申请号：CZ324497

申请日：1997-10-13

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/40

Abstract: The present invention relates to an assembly mount supporting a heat sink (16) relative to a surface of an electronic device (15) on a substrate (13) to enable heat to pass from said device (15) to said heat sink (16). The invented assembly mount comprises at least two flexible, retention posts (11, 12) affixed to members secured to a surface of the substrate (13) at a predetermined angle and each of said flexible, retention post (11, 12) has two ends, one of said ends being removably affixed to said surface of said substrate (13), and the other of said ends having means frictionally engaging and supporting the heat sink (16) in such a manner that said heat sink (16) is supported in a close, heat transferring position relative to said electronic device (15).

公开(公告)号：HU9701129D0

公开(公告)日：1997-08-28

申请号：HU9701129

申请日：1997-06-30

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/40

公开(公告)号：HU221213B1

公开(公告)日：2002-08-28

申请号：HU9701129

申请日：1997-06-30

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/40 ,  H05K7/20

公开(公告)号：PL322814A1

公开(公告)日：1998-04-27

申请号：PL32281497

申请日：1997-10-24

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/40 ,  H05K7/20