公开(公告)号：DE69402448D1

公开(公告)日：1997-05-15

申请号：DE69402448

申请日：1994-01-27

Applicant: IBM

Inventor： ALPAUGH WARREN A ,  MARKOVICH VOYA R ,  TRIVEDI AJIT K ,  ZARR RICHARD S

IPC: H01L23/12 ,  H01L23/50 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A printed circuit board or card for direct chip attachment that includes at least one power core (P1), at least one signal plane (51) that is adjacent to the power core, and plated through holes (11) for electrical connection is provided. In addition, a layer of dielectric material (13) is adjacent the power core and a circuitized conductive layer (12, 14) is adjacent the dielectric material, followed by a layer of photosensitive dielectric material (15) adjacent the conductive layer. Photodeveloped blind vias (17) for subsequent connection to the power core and drilled blind vias (18) for subsequent connection to the signal plane are provided. Also provided is process for fabricating the printed circuit board or card for direct chip attachment.

公开(公告)号：DE69402448T2

公开(公告)日：1997-09-25

申请号：DE69402448

申请日：1994-01-27

Applicant: IBM

Inventor： ALPAUGH WARREN A ,  MARKOVICH VOYA R ,  TRIVEDI AJIT K ,  ZARR RICHARD S

IPC: H01L23/12 ,  H01L23/50 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A printed circuit board or card for direct chip attachment that includes at least one power core (P1), at least one signal plane (51) that is adjacent to the power core, and plated through holes (11) for electrical connection is provided. In addition, a layer of dielectric material (13) is adjacent the power core and a circuitized conductive layer (12, 14) is adjacent the dielectric material, followed by a layer of photosensitive dielectric material (15) adjacent the conductive layer. Photodeveloped blind vias (17) for subsequent connection to the power core and drilled blind vias (18) for subsequent connection to the signal plane are provided. Also provided is process for fabricating the printed circuit board or card for direct chip attachment.