公开(公告)号：SG99289A1

公开(公告)日：2003-10-27

申请号：SG1999004765

申请日：1999-09-22

Applicant: IBM

Inventor： VLASTA A BRUSIC ,  DANIEL CHARLES EDELSTEIN ,  PAUL M FENNEY ,  WILLIAM GUTHRIE ,  MARK JASO ,  FRANK B KAUFMAN ,  NAFTALI LUSTIG ,  PETER ROPER ,  KENNETH RODBELL ,  DAVID B THOMPSON

IPC: C09G1/02 ,  C09K13/04 ,  B24C11/00 ,  C23F3/00 ,  H01L21/321

Abstract: Copper or a copper alloy is removed by chemical-mechanical planarisation (CMP) in a slurry of an oxidizer, an oxidation inhibitor, and an additive that appreciably regulates copper complexing with the oxidation inhibitor.