公开(公告)号：NO335756B1

公开(公告)日：2015-02-09

申请号：NO20014460

申请日：2001-09-14

Applicant: ION GEOPHYSICAL CORP

Inventor： BEHN LAWRENCE P ,  MAXWELL PETER ,  RUSHEFSKY LARRY ,  SIGMAR AXEL ,  GOLDBERG HOWARD D ,  STALNAKER W MARC ,  RINNE RAY ,  BALDERES DEMETRIOS ,  LEMKE AL ,  IP MATTHEW ,  DOMAGALSKI KLAUS ,  YU LIANZHONG ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  MORGAN DAVID ,  BUIE THOMAS ,  FABER KEES ,  ALTMAN SJOERD ,  LAROO RICHARD

IPC: G01D11/24 ,  G01P21/00 ,  G01D18/00 ,  G01D21/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

Abstract: Sensor (104) som omfatter flere sensorpakker (405), hver med en hovedakse (415, 420, 425) for maksimal følsomhet og anordnet i sin respektive retning i rommet, forskjellig fra hovedaksens retning for de øvrige sensorpakker. Sensorpakkene omfatter et hus (205), et eller flere sensorelementer (544, 546, 548), en lokksammenstilling (506) og en sentral enhet (508), blant annet for styring.

公开(公告)号：CA2714788A1

公开(公告)日：2001-01-18

申请号：CA2714788

申请日：2000-07-13

Applicant: ION GEOPHYSICAL CORP

Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

IPC: B81C1/00 ,  G02B26/10 ,  B81B3/00 ,  B81B5/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224

Abstract: The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

公开(公告)号：CA2714788C

公开(公告)日：2013-11-12

申请号：CA2714788

申请日：2000-07-13

Applicant: ION GEOPHYSICAL CORP

Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

IPC: B81C1/00 ,  G02B26/10 ,  B81B3/00 ,  B81B5/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224

Abstract: The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

公开(公告)号：DE60042757D1

公开(公告)日：2009-09-24

申请号：DE60042757

申请日：2000-09-25

Applicant: ION GEOPHYSICAL CORP

Inventor： YU LIANZHONG ,  GOLDBERG HOWARD D ,  YU DULI

IPC: B44C1/22 ,  G02B26/10 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/00 ,  G03F7/20 ,  H01L21/306

Abstract: A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

公开(公告)号：DE60039432D1

公开(公告)日：2008-08-21

申请号：DE60039432

申请日：2000-07-13

Applicant: ION GEOPHYSICAL CORP

Inventor： YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D ,  SCHMIDT MARTIN A ,  RIED ROBERT P

IPC: G02B7/182 ,  G02B26/10 ,  B81B3/00 ,  G02B26/08 ,  G06K7/10

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.

公开(公告)号：NO332471B1

公开(公告)日：2012-09-24

申请号：NO20014469

申请日：2001-09-14

Applicant: ION GEOPHYSICAL CORP

Inventor： GOLDBERG HOWARD D ,  STALNAKER W MARC ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L

IPC: G01P21/00 ,  H05K5/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

公开(公告)号：NO20100794A

公开(公告)日：2002-03-12

申请号：NO20100794

申请日：2010-06-01

Applicant: ION GEOPHYSICAL CORP

Inventor： GOLDBERG HOWARD D ,  YU LIANZHONG ,  RIED ROBERT P ,  YU DULI

IPC: B81B1/00 ,  G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20

CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

公开(公告)号：NO334310B1

公开(公告)日：2014-02-03

申请号：NO20014464

申请日：2001-09-14

Applicant: ION GEOPHYSICAL CORP

Inventor： SCHMIDT MARTIN A ,  GOLDBERG HOWARD D ,  IP MATTHEW ,  SELVAKUMAR ARJUN ,  YU DULI ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P15/08 ,  G01P21/00 ,  B81B7/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00

公开(公告)号：NO329678B1

公开(公告)日：2010-11-29

申请号：NO20020139

申请日：2002-01-11

Applicant: ION GEOPHYSICAL CORP

Inventor： GOLDBERG HOWARD D ,  YU DULI ,  YU LIANZHONG ,  RIED ROBERT P

IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224

Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

公开(公告)号：NO326146B1

公开(公告)日：2008-10-06

申请号：NO20020140

申请日：2002-01-11

Applicant: ION GEOPHYSICAL CORP

Inventor： SCHMIDT MARTIN A ,  GOLDBERG HOWARD D ,  YU DULI ,  YU LIANZHONG ,  RIED ROBERT P

IPC: G02B7/182 ,  G02B26/10 ,  B81B3/00 ,  G02B26/08 ,  G06K7/10

Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.