公开(公告)号：JPS6114798A

公开(公告)日：1986-01-22

申请号：JP1564885

申请日：1985-01-31

Applicant: Ibm

Inventor： LEVINE ERNEST NORMAN ,  LIPSCHUTZ LEWIS DRUCKER ,  QUINONES HORATIO

IPC: H05K3/34 ,  C25D21/14 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3436 ,  H01L2924/00

Abstract: Arrays of solder interconnections between a semiconductor device (10) and a supporting substrate (12) are annealed for a time in excess of one or several days below the solder melting temperature to relief stress and improve the fatigue failure of the interconnections.

公开(公告)号：DE3570154D1

公开(公告)日：1989-06-15

申请号：DE3570154

申请日：1985-06-13

Applicant: IBM

Inventor： LEVINE ERNEST NORMAN ,  LIPSCHUTZ LEWIS DRUCKER ,  QUINONES HORATIO

IPC: H05K3/34 ,  C25D21/14 ,  H01L21/60 ,  H01L21/92 ,  H01L21/324

Abstract: Arrays of solder interconnections between a semiconductor device (10) and a supporting substrate (12) are annealed for a time in excess of one or several days below the solder melting temperature to relief stress and improve the fatigue failure of the interconnections.