公开(公告)号：JPS6114798A

公开(公告)日：1986-01-22

申请号：JP1564885

申请日：1985-01-31

Applicant: Ibm

Inventor： LEVINE ERNEST NORMAN ,  LIPSCHUTZ LEWIS DRUCKER ,  QUINONES HORATIO

IPC: H05K3/34 ,  C25D21/14 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3436 ,  H01L2924/00

Abstract: Arrays of solder interconnections between a semiconductor device (10) and a supporting substrate (12) are annealed for a time in excess of one or several days below the solder melting temperature to relief stress and improve the fatigue failure of the interconnections.

公开(公告)号：DE1115487B

公开(公告)日：1961-10-19

申请号：DEI0017415

申请日：1959-12-19

Applicant: IBM

Inventor： LIPSCHUTZ LEWIS DRUCKER ,  HARRIS JOHN PAUL

IPC: G11B5/74 ,  G11B5/80

公开(公告)号：DE3570154D1

公开(公告)日：1989-06-15

申请号：DE3570154

申请日：1985-06-13

Applicant: IBM

Inventor： LEVINE ERNEST NORMAN ,  LIPSCHUTZ LEWIS DRUCKER ,  QUINONES HORATIO

IPC: H05K3/34 ,  C25D21/14 ,  H01L21/60 ,  H01L21/92 ,  H01L21/324

Abstract: Arrays of solder interconnections between a semiconductor device (10) and a supporting substrate (12) are annealed for a time in excess of one or several days below the solder melting temperature to relief stress and improve the fatigue failure of the interconnections.

公开(公告)号：DE3788589T2

公开(公告)日：1994-06-30

申请号：DE3788589

申请日：1987-03-06

Applicant: IBM

Inventor： LIPSCHUTZ LEWIS DRUCKER

IPC: B23K3/04 ,  B23K1/012 ,  H01L21/60 ,  H05K3/34 ,  H01L21/58 ,  H01R43/02 ,  H05K13/04

Abstract: An apparatus (10) for reflowing solder terminals (22) that join an electronic element (20) to a substrate (16) which includes a stage for supporting the substrate, a quantity of fluid capable of being heated to a temperature in excess of the melting point of the solder to be reflowed, a means to contact the surface of the substrate with the fluid, the means including at least one reservoir for maintaining fluid at a temperature in excess of the melting point of the solder, and a pumping means to move the fluid from the reservoir into contact with the surface of the substrate. A method of reflowing solder terminals that join an electronic device to a substrate that includes the steps of contacting the bottom surface of the substrate with a fluid, rapidly increasing the temperature of the fluid to a temperature exceeding the melting point of the solder material of the solder terminal, and subsequently rapidly decreasing the temperature of the fluid.

公开(公告)号：DE3374491D1

公开(公告)日：1987-12-17

申请号：DE3374491

申请日：1983-02-08

Applicant: IBM

Inventor： BALDERES DEMETRIOS ,  HORVATH JOSEPH LOUIS ,  LIPSCHUTZ LEWIS DRUCKER

IPC: H01L23/44 ,  F28F3/02 ,  H01L23/36 ,  H01L23/433 ,  H01L23/42

公开(公告)号：DE3788589D1

公开(公告)日：1994-02-10

申请号：DE3788589

申请日：1987-03-06

Applicant: IBM

Inventor： LIPSCHUTZ LEWIS DRUCKER

IPC: B23K3/04 ,  B23K1/012 ,  H01L21/60 ,  H05K3/34 ,  H01L21/58 ,  H01R43/02 ,  H05K13/04

Abstract: An apparatus (10) for reflowing solder terminals (22) that join an electronic element (20) to a substrate (16) which includes a stage for supporting the substrate, a quantity of fluid capable of being heated to a temperature in excess of the melting point of the solder to be reflowed, a means to contact the surface of the substrate with the fluid, the means including at least one reservoir for maintaining fluid at a temperature in excess of the melting point of the solder, and a pumping means to move the fluid from the reservoir into contact with the surface of the substrate. A method of reflowing solder terminals that join an electronic device to a substrate that includes the steps of contacting the bottom surface of the substrate with a fluid, rapidly increasing the temperature of the fluid to a temperature exceeding the melting point of the solder material of the solder terminal, and subsequently rapidly decreasing the temperature of the fluid.

公开(公告)号：DE3277157D1

公开(公告)日：1987-10-08

申请号：DE3277157

申请日：1982-06-02

Applicant: IBM

Inventor： LIPSCHUTZ LEWIS DRUCKER

IPC: H01L23/473 ,  H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/42

Abstract: A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate or cover, featuring a plurality of thin flexible interleaved leaf elements (36, 42) capable of bridging the gap between the device and cold plate, and accommodating for gap variability and non-parallel surfaces. Two sets of bolted together (40), spaced, interleaved, flexible elements are biased by spring means (60) away from each other to form a thermal conduction element.