4.
    发明专利
    未知

    公开(公告)号:DE3788589T2

    公开(公告)日:1994-06-30

    申请号:DE3788589

    申请日:1987-03-06

    Applicant: IBM

    Abstract: An apparatus (10) for reflowing solder terminals (22) that join an electronic element (20) to a substrate (16) which includes a stage for supporting the substrate, a quantity of fluid capable of being heated to a temperature in excess of the melting point of the solder to be reflowed, a means to contact the surface of the substrate with the fluid, the means including at least one reservoir for maintaining fluid at a temperature in excess of the melting point of the solder, and a pumping means to move the fluid from the reservoir into contact with the surface of the substrate. A method of reflowing solder terminals that join an electronic device to a substrate that includes the steps of contacting the bottom surface of the substrate with a fluid, rapidly increasing the temperature of the fluid to a temperature exceeding the melting point of the solder material of the solder terminal, and subsequently rapidly decreasing the temperature of the fluid.

    6.
    发明专利
    未知

    公开(公告)号:DE3788589D1

    公开(公告)日:1994-02-10

    申请号:DE3788589

    申请日:1987-03-06

    Applicant: IBM

    Abstract: An apparatus (10) for reflowing solder terminals (22) that join an electronic element (20) to a substrate (16) which includes a stage for supporting the substrate, a quantity of fluid capable of being heated to a temperature in excess of the melting point of the solder to be reflowed, a means to contact the surface of the substrate with the fluid, the means including at least one reservoir for maintaining fluid at a temperature in excess of the melting point of the solder, and a pumping means to move the fluid from the reservoir into contact with the surface of the substrate. A method of reflowing solder terminals that join an electronic device to a substrate that includes the steps of contacting the bottom surface of the substrate with a fluid, rapidly increasing the temperature of the fluid to a temperature exceeding the melting point of the solder material of the solder terminal, and subsequently rapidly decreasing the temperature of the fluid.

    FLEXIBLE THERMAL CONDUCTION ELEMENT FOR COOLING SEMICONDUCTOR DEVICES

    公开(公告)号:DE3277157D1

    公开(公告)日:1987-10-08

    申请号:DE3277157

    申请日:1982-06-02

    Applicant: IBM

    Abstract: A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate or cover, featuring a plurality of thin flexible interleaved leaf elements (36, 42) capable of bridging the gap between the device and cold plate, and accommodating for gap variability and non-parallel surfaces. Two sets of bolted together (40), spaced, interleaved, flexible elements are biased by spring means (60) away from each other to form a thermal conduction element.

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